| Characterizing the soldering alloy type In–Ag–Ti and the study of direct soldering of SiC ceramics and copper R Koleňák, I Kostolný, J Drápala, M Sahul, J Urminský Metals 8 (4), 274, 2018 | 18 | 2018 |
| Study of direct bonding ceramics with metal using Sn2La solder R Koleňák, I Kostolný Advances in Materials Science and Engineering 2015 (1), 269167, 2015 | 17 | 2015 |
| Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder R Koleňák, I Kostolný, J Drápala, M Kusý, M Pašák Soldering & Surface Mount Technology 31 (2), 93-101, 2019 | 16 | 2019 |
| Direct bonding of silicon with solders type Sn-Ag-Ti R Kolenak, I Kostolný, M Sahul Soldering & Surface Mount Technology 28 (3), 149-158, 2016 | 14 | 2016 |
| Research of fluxless soldering of high-purity aluminium with solders type Zn-Al R Koleňák, I Kostolný, R Čička Advanced Materials Research 905, 132-136, 2014 | 14 | 2014 |
| Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper R Koleňák, I Kostolný, M Kusý Materials Science and Engineering: A 712, 302-312, 2018 | 13 | 2018 |
| Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn–In–Mg R Koleňák, I Kostolný, J Drápala, M Drienovský, M Sahul Journal of Composite Materials 53 (10), 1411-1422, 2019 | 11 | 2019 |
| Investigation of ultrasound-assisted soldering of SiC ceramics by Zn-Al-In high-temperature solder I Kostolný, R Koleňák, E Hodúlová, P Zacková, M Kusý Welding in the World 63, 1449-1459, 2019 | 7* | 2019 |
| Fluxless ultrasonic soldering of SiC ceramics and Cu by Bi–Ag–Ti based solder D Šuryová, I Kostolný, R Koleňák AIMS Materials Science 7 (1), 24-32, 2020 | 5 | 2020 |
| Ultrasonic soldering of Cu AND Al2O3 ceramics by use of Bi-La and Bi-Ag-La solders R Koleňák, M Prach, I Kostolný Acta Polytechnica 56 (2), 126-131, 2016 | 4 | 2016 |
| Study of direct bonding of ceramic and metallic materials with Zn4Al solder R Koleňák, I Kostolný Acta Polytechnica Hungarica 13 (4), 1-19, 2016 | 4 | 2016 |
| Research of interactions between Al substrate and Zn-Al solders I Kostolný, R Koleňák Procedia Engineering 100, 1319-1323, 2015 | 4 | 2015 |
| Investigation of the influence of alloying elements in Zn-Al alloy on thermal and mechanical properties I Kostolný, R Koleňák Proceedings of the 26th DAAAM International Symposium, DAAAM International …, 2015 | 4 | 2015 |
| Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures. R Koleňák, I Kostolný AIMS Materials Science 5 (5), 2018 | 3 | 2018 |
| Investigation of flux-less soldering of metal matrix composite and ceramics by use of Zn solder R Koleňák, I Kostolný Key Engineering Materials 759, 29-34, 2018 | 2 | 2018 |
| Effect of in addition on microstructure and properties of Zn-5Al solder R Koleňák, I Kostolný Key Engineering Materials 737, 107-113, 2017 | 2 | 2017 |
| Soldering by the active lead-free tin and bismuth-based solders R Koleňák, M Provazník, I Kostolný Lead Free Solders, 2018 | 1 | 2018 |
| Wettability of selected lead-free solders for higher application temperatures R Koleňák, I Kostolný, P Šebo Key Engineering Materials 705, 190-195, 2016 | 1 | 2016 |
| Influence of alloying elements in ZnAl5 based alloys on melting temperature, tensile strength and Vickers hardness R Koleňák, I Kostolný Applied Mechanics and Materials 835, 185-190, 2016 | 1 | 2016 |
| Study of wettability and solderability of SiC ceramics with Ni by use of Sn-Sb-Ti solder by heating with electron beam in vacuum R Koleňák, I Kostolný, J Drápala, J Urminský, A Pluhár, P Babincová, ... MDPI, 2022 | | 2022 |
