Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining J Yan, T Asami, H Harada, T Kuriyagawa Precision engineering 33 (4), 378-386, 2009 | 285 | 2009 |
Ductile regime turning at large tool feed J Yan, K Syoji, T Kuriyagawa, H Suzuki Journal of Materials Processing Technology 121 (2-3), 363-372, 2002 | 245 | 2002 |
On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications J Yan, M Yoshino, T Kuriagawa, T Shirakashi, K Syoji, R Komanduri Materials Science and Engineering: A 297 (1-2), 230-234, 2001 | 209 | 2001 |
Mechanism for material removal in diamond turning of reaction-bonded silicon carbide J Yan, Z Zhang, T Kuriyagawa International Journal of Machine Tools and Manufacture 49 (5), 366-374, 2009 | 204 | 2009 |
Dose-dependent osteogenic effect of octacalcium phosphate on mouse bone marrow stromal cells T Anada, T Kumagai, Y Honda, T Masuda, R Kamijo, S Kamakura, ... Tissue Engineering Part A 14 (6), 965-978, 2008 | 183 | 2008 |
Precision machining of microstructures on electroless-plated NiP surface for molding glass components J Yan, T Oowada, T Zhou, T Kuriyagawa Journal of Materials Processing Technology 209 (10), 4802-4808, 2009 | 180 | 2009 |
A new grinding method for aspheric ceramic mirrors T Kuriyagawa, MSS Zahmaty, K Syoji Journal of Materials Processing Technology 62 (4), 387-392, 1996 | 163 | 1996 |
Modeling high-temperature glass molding process by coupling heat transfer and viscous deformation analysis J Yan, T Zhou, J Masuda, T Kuriyagawa Precision Engineering 33 (2), 150-159, 2009 | 157 | 2009 |
Electrorheological fluid-assisted ultra-precision polishing for small three-dimensional parts T Kuriyagawa, M Saeki, K Syoji Precision engineering 26 (4), 370-380, 2002 | 144 | 2002 |
Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM PJ Liew, J Yan, T Kuriyagawa International Journal of Machine Tools and Manufacture 76, 13-20, 2014 | 135 | 2014 |
Crystallographic effect on subsurface damage formation in silicon microcutting J Yan, T Asami, H Harada, T Kuriyagawa CIRP annals 61 (1), 131-134, 2012 | 135 | 2012 |
Micro grooving on single-crystal germanium for infrared Fresnel lenses J Yan, K Maekawa, J Tamaki, T Kuriyagawa Journal of micromechanics and microengineering 15 (10), 1925, 2005 | 134 | 2005 |
Optimization of cutting conditions for single pass turning operations using a deterministic approach J Wang, T Kuriyagawa, XP Wei, DM Guo International Journal of Machine Tools and Manufacture 42 (9), 1023-1033, 2002 | 133 | 2002 |
Machining of micro aspherical mould inserts WK Chen, T Kuriyagawa, H Huang, N Yosihara Precision Engineering 29 (3), 315-323, 2005 | 132 | 2005 |
Investigation on the viscoelasticity of optical glass in ultraprecision lens molding process T Zhou, J Yan, J Masuda, T Kuriyagawa Journal of materials processing technology 209 (9), 4484-4489, 2009 | 115 | 2009 |
Fabricating micro-structured surface by using single-crystalline diamond endmill J Yan, Z Zhang, T Kuriyagawa, H Gonda The International Journal of Advanced Manufacturing Technology 51, 957-964, 2010 | 112 | 2010 |
Load effects on the phase transformation of single-crystal silicon during nanoindentation tests J Yan, H Takahashi, X Gai, H Harada, J Tamaki, T Kuriyagawa Materials science and engineering: A 423 (1-2), 19-23, 2006 | 112 | 2006 |
A multiprocess machine tool for compound micromachining M Rahman, A Asad, T Masaki, T Saleh, YS Wong, AS Kumar International Journal of Machine Tools and Manufacture 50 (4), 344-356, 2010 | 109 | 2010 |
Nondestructive measurement of machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy J Yan, T Asami, T Kuriyagawa Precision Engineering 32 (3), 186-195, 2008 | 109 | 2008 |
An experimental study to enhance the cutting performance in abrasive waterjet machining J Wang, T Kuriyagawa, CZ Huang Machining Science and Technology 7 (2), 191-207, 2003 | 97 | 2003 |