关注
Tsunemoto Kuriyagawa (厨川常元)
Tsunemoto Kuriyagawa (厨川常元)
在 tohoku.ac.jp 的电子邮件经过验证
标题
引用次数
引用次数
年份
Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining
J Yan, T Asami, H Harada, T Kuriyagawa
Precision engineering 33 (4), 378-386, 2009
2852009
Ductile regime turning at large tool feed
J Yan, K Syoji, T Kuriyagawa, H Suzuki
Journal of Materials Processing Technology 121 (2-3), 363-372, 2002
2452002
On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications
J Yan, M Yoshino, T Kuriagawa, T Shirakashi, K Syoji, R Komanduri
Materials Science and Engineering: A 297 (1-2), 230-234, 2001
2092001
Mechanism for material removal in diamond turning of reaction-bonded silicon carbide
J Yan, Z Zhang, T Kuriyagawa
International Journal of Machine Tools and Manufacture 49 (5), 366-374, 2009
2042009
Dose-dependent osteogenic effect of octacalcium phosphate on mouse bone marrow stromal cells
T Anada, T Kumagai, Y Honda, T Masuda, R Kamijo, S Kamakura, ...
Tissue Engineering Part A 14 (6), 965-978, 2008
1832008
Precision machining of microstructures on electroless-plated NiP surface for molding glass components
J Yan, T Oowada, T Zhou, T Kuriyagawa
Journal of Materials Processing Technology 209 (10), 4802-4808, 2009
1802009
A new grinding method for aspheric ceramic mirrors
T Kuriyagawa, MSS Zahmaty, K Syoji
Journal of Materials Processing Technology 62 (4), 387-392, 1996
1631996
Modeling high-temperature glass molding process by coupling heat transfer and viscous deformation analysis
J Yan, T Zhou, J Masuda, T Kuriyagawa
Precision Engineering 33 (2), 150-159, 2009
1572009
Electrorheological fluid-assisted ultra-precision polishing for small three-dimensional parts
T Kuriyagawa, M Saeki, K Syoji
Precision engineering 26 (4), 370-380, 2002
1442002
Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM
PJ Liew, J Yan, T Kuriyagawa
International Journal of Machine Tools and Manufacture 76, 13-20, 2014
1352014
Crystallographic effect on subsurface damage formation in silicon microcutting
J Yan, T Asami, H Harada, T Kuriyagawa
CIRP annals 61 (1), 131-134, 2012
1352012
Micro grooving on single-crystal germanium for infrared Fresnel lenses
J Yan, K Maekawa, J Tamaki, T Kuriyagawa
Journal of micromechanics and microengineering 15 (10), 1925, 2005
1342005
Optimization of cutting conditions for single pass turning operations using a deterministic approach
J Wang, T Kuriyagawa, XP Wei, DM Guo
International Journal of Machine Tools and Manufacture 42 (9), 1023-1033, 2002
1332002
Machining of micro aspherical mould inserts
WK Chen, T Kuriyagawa, H Huang, N Yosihara
Precision Engineering 29 (3), 315-323, 2005
1322005
Investigation on the viscoelasticity of optical glass in ultraprecision lens molding process
T Zhou, J Yan, J Masuda, T Kuriyagawa
Journal of materials processing technology 209 (9), 4484-4489, 2009
1152009
Fabricating micro-structured surface by using single-crystalline diamond endmill
J Yan, Z Zhang, T Kuriyagawa, H Gonda
The International Journal of Advanced Manufacturing Technology 51, 957-964, 2010
1122010
Load effects on the phase transformation of single-crystal silicon during nanoindentation tests
J Yan, H Takahashi, X Gai, H Harada, J Tamaki, T Kuriyagawa
Materials science and engineering: A 423 (1-2), 19-23, 2006
1122006
A multiprocess machine tool for compound micromachining
M Rahman, A Asad, T Masaki, T Saleh, YS Wong, AS Kumar
International Journal of Machine Tools and Manufacture 50 (4), 344-356, 2010
1092010
Nondestructive measurement of machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy
J Yan, T Asami, T Kuriyagawa
Precision Engineering 32 (3), 186-195, 2008
1092008
An experimental study to enhance the cutting performance in abrasive waterjet machining
J Wang, T Kuriyagawa, CZ Huang
Machining Science and Technology 7 (2), 191-207, 2003
972003
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