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Josef Hansson
Josef Hansson
CTO, Myvox AB
Verified email at chalmers.se
Title
Cited by
Cited by
Year
Novel nanostructured thermal interface materials: a review
J Hansson, TMJ Nilsson, L Ye, J Liu
International Materials Reviews 63 (1), 22-45, 2018
3352018
Graphene related materials for thermal management
Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ...
2D Materials 7 (1), 012001, 2020
1962020
Review of current progress of thermal interface materials for electronics thermal management applications
J Hansson, C Zandén, L Ye, J Liu
2016 IEEE 16th international conference on nanotechnology (IEEE-NANO), 371-374, 2016
522016
Effects of high temperature treatment of carbon nanotube arrays on graphite: increased crystallinity, anchoring and inter-tube bonding
J Hansson, A Nylander, M Flygare, K Svensson, L Ye, T Nilsson, Y Fu, ...
Nanotechnology 31 (45), 455708, 2020
182020
Degradation of carbon nanotube array thermal interface materials through thermal aging: Effects of bonding, array height, and catalyst oxidation
A Nylander, J Hansson, T Nilsson, L Ye, Y Fu, J Liu
ACS Applied Materials & Interfaces 13 (26), 30992-31000, 2021
162021
Bipolar electrochemical capacitors using double-sided carbon nanotubes on graphite electrodes
J Hansson, Q Li, A Smith, I Zakaria, T Nilsson, A Nylander, L Ye, ...
Journal of Power Sources 451, 227765, 2020
112020
Reliability investigation of a carbon nanotube array thermal Interface material
A Nylander, J Hansson, M Kabiri Samani, C Chandra Darmawan, ...
Energies 12 (11), 2080, 2019
112019
Bin
Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ...
Wang Q, Li M, Lu H, Sledzinska M, Torres CMSS, Volz S, Balandin AA, Xu X and …, 2020
82020
Synthesis of a graphene carbon nanotube hybrid film by joule self-heating CVD for thermal applications
J Hansson, MK Samani, A Nylander, L Ye, N Wang, T Nilsson, J Liu
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2450-2456, 2018
82018
Double-Densified Vertically Aligned Carbon Nanotube bundles for application in 3D integration high aspect ratio TSV interconnects
W Mu, J Hansson, S Sun, M Edwards, Y Fu, K Jeppson, J Liu
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 211-216, 2016
62016
Fabrication and characterization of a carbon fiber solder composite thermal interface material
J Hansson, L Ye, J Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 97-100, 2017
52017
Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials
M Satwara, J Hansson, L Ye, H Rhedin, J Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 167-171, 2017
22017
2D Materials Graphene related materials for thermal management Graphene related materials for thermal management
Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ...
2D Materials, 2019
12019
Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material
J Hansson, TMJ Nilsson, L Ye, J Liu
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019
12019
Exploration of Metal Composites and Carbon Nanotubes for Thermal Interfaces
J Hansson
PQDT-Global, 2020
2020
RF Properties of Carbon Nanotube/Copper Composite Through Silicon Via Based CPW Structure for 3D Integrated Circuits
A Nylander, M Bonmann, A Vorobiev, J Hansson, N Wang, Y Fu, J Liu
2019 IEEE 14th Nanotechnology Materials and Devices Conference (NMDC), 1-5, 2019
2019
Solder Matrix Fiber Composite Thermal Interface Materials
J Hansson
PQDT-Global, 2018
2018
Utvecklandet av en metod för automatisk analys av systemprestanda i specifika testfall för radiobasstationer
J Hansson, F Lundin, M Mazur
2013
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