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Amogh Biju
Amogh Biju
University of Southern California
在 usc.edu 的电子邮件经过验证
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The Challenge of Multiple Thermal Comfort Prediction Models: Is TSV Enough?
B Lala, A Biju, Vanshita, A Rastogi, K Dahiya, SM Kala, A Hagishima
Buildings 13 (4), 890, 2023
32023
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