| Multi-physics modeling and characterization of components on flexible substrates S Sivapurapu, R Chen, C Mehta, Y Zhou, MLF Bellaredj, X Jia, PA Kohl, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 20 | 2019 |
| Mechanical and high-frequency electrical study of printed, flexible antenna under deformation Y Zhou, S Sivapurapu, M Swaminathan, SK Sitaraman IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 18 | 2020 |
| Study of electrical and mechanical characteristics of inkjet-printed patch antenna under uniaxial and biaxial bending Y Zhou, S Sivapurapu, R Chen, NA Amoli, M Bellaredj, M Swaminathan, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1939-1945, 2019 | 13 | 2019 |
| Screen-printed flexible coplanar waveguide transmission lines: Multi-physics modeling and measurement NA Amoli, S Sivapurapu, R Chen, Y Zhou, MLF Bellaredj, PA Kohl, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 249-257, 2019 | 12 | 2019 |
| Cyclic bending effects on resistance of screen-printed silver conductors R Chen, JH Chow, Y Zhou, JS Meth, SK Sitaraman IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 10 | 2021 |
| Mechanical and Ka-band electrical reliability testing of interconnects in 5G wearable system-on-package designs under bending Y Zhou, K Hu, MM Tentzeris, SK Sitaraman 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 914-923, 2022 | 8 | 2022 |
| Multi-physics modeling characterization of aerosol jet printed transmission lines S Sivapurapu, C Mehta, R Chen, X Jia, Y Zhou, M Bellaredj, PA Kohl, ... 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2018 | 7 | 2018 |
| Fully additively manufactured flexible dual-band slotted patch antenna for 5G/mmWave wearable applications K Hu, Y Zhou, SK Sitaraman, MM Tentzeris 2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI …, 2022 | 6 | 2022 |
| Thermal cycling simulation and sensitivity analysis of wafer level chip scale package with integration of metal-insulator-metal capacitors Y Zhou, L Chen, Y Liu, S Sitaraman 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1521-1528, 2019 | 4 | 2019 |
| Additively manufactured flexible on-package phased array antennas for 5G/mmWave wearable and conformal digital twin and massive MIMO applications K Hu, Y Zhou, SK Sitaraman, MM Tentzeris Scientific Reports 13 (1), 12515, 2023 | 3 | 2023 |
| Additively manufactured flexible material characterization and on-demand “smart” packaging topologies for 5g/mmwave wearable applications K Hu, Y Zhou, SK Sitaraman, MM Tentzeris 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 437-443, 2023 | 2 | 2023 |
| Mandrel Bend Test of Screen-Printed Silver Conductors R Chen, J Chow, Y Zhou, SK Sitaraman Journal of Electronic Packaging 145 (3), 031004, 2023 | 1 | 2023 |
| Advanced Packaging Technologies A Alatoom, A Al-Othman, H Al-Nashash, M Al-Sayah, Y Zhou, ... | | |
Sridhar SivapurapuGeorgia Institute of TechnologyVerified email at gatech.edu
