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SiJun Kim
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Characterization of SiO2 Etching Profiles in Pulse-Modulated Capacitively Coupled Plasmas
C Cho, K You, S Kim, Y Lee, J Lee, S You
Materials 14 (17), 5036, 2021
342021
Characterization of SiO2 Over Poly-Si Mask Etching in Ar/C4F8 Capacitively Coupled Plasma
IH Seong, JJ Lee, CH Cho, YS Lee, SJ Kim, SJ You
Applied Science and Convergence Technology 30 (6), 176-182, 2021
202021
A transmission line model of the cutoff probe
SJ Kim, JJ Lee, DW Kim, JH Kim, SJ You
Plasma Sources Science and Technology 28 (5), 055014, 2019
202019
Crossing Frequency Method Applicable to Intermediate Pressure Plasma Diagnostics Using the Cutoff Probe
S Kim, J Lee, Y Lee, C Cho, S You
Sensors 22 (3), 1291, 2022
142022
Planar cutoff probe for measuring the electron density of low-pressure plasmas
DW Kim, SJ You, SJ Kim, JH Kim, JY Lee, WS Kang, M Hur
Plasma Sources Science and Technology 28 (1), 015004, 2019
142019
A Quantification Method in Quadrupole Mass Spectrometer Measurement
YS Lee, SH Oh, JJ Lee, CH Cho, SJ Kim, SJ You
Applied Science and Convergence Technology 30 (2), 50-53, 2021
102021
Effect of an inhomogeneous electron density profile on the transmission microwave frequency spectrum of the cutoff probe
SJ Kim, JJ Lee, YS Lee, DW Kim, SJ You
Plasma Sources Science and Technology 29 (12), 125014, 2020
92020
Computational Characterization of Microwave Planar Cutoff Probes for Non-Invasive Electron Density Measurement in Low-Temperature Plasma: Ring-and Bar-Type Cutoff Probes
SJ Kim, JJ Lee, YS Lee, HJ Yeom, HC Lee, JH Kim, SJ You
Applied Sciences 10 (20), 7066, 2020
92020
Various evolution trends of sample thickness in fluorocarbon film deposition on SiO2
Y Lee, I Seong, J Lee, S Lee, C Cho, S Kim, SJ You
Journal of Vacuum Science & Technology A 40 (1), 2022
82022
Influence of Additive N2 on O2 Plasma Ashing Process in Inductively Coupled Plasma
YB You, YS Lee, SJ Kim, CH Cho, IH Seong, WN Jeong, MS Choi, SJ You
Nanomaterials 12 (21), 3798, 2022
72022
Finding the optimum design of the planar cutoff probe through a computational study
SJ Kim, JJ Lee, YS Lee, DW Kim, SJ You
AIP Advances 11 (2), 2021
72021
Characteristics of SiO2 Etching by Capacitively Coupled Plasma with Different Fluorocarbon Liquids (C7F14, C7F8) and Fluorocarbon Gas (C4F8)
SW Yoo, C Cho, K Kim, H Lee, S You
Applied Science and Convergence Technology 30 (4), 102-106, 2021
62021
Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma
I Seong, J Lee, S Kim, Y Lee, C Cho, J Lee, W Jeong, Y You, S You
Nanomaterials 12 (22), 3963, 2022
52022
Low-Temperature Plasma Diagnostics to Investigate the Process Window Shift in Plasma Etching of SiO2
Y Lee, S Kim, J Lee, C Cho, I Seong, S You
Sensors 22 (16), 6029, 2022
52022
Purgeless atomic layer etching of SiO2
YS Lee, SJ Kim, JJ Lee, CH Cho, IH Seong, SJ You
Journal of Physics D: Applied Physics 55 (36), 365203, 2022
52022
Development of High-precision RF Sensor
KK Kim, JJ Lee, SJ Kim, CH Cho, SW Yoo, SJ You
Applied Science and Convergence Technology 28 (4), 88-92, 2019
52019
Contribution of Ion Energy and Flux on High-Aspect Ratio SiO2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C4F8 Plasma: Individual Ion …
W Jeong, S Kim, Y Lee, C Cho, I Seong, Y You, M Choi, J Lee, Y Seol, ...
Materials 16 (10), 3820, 2023
42023
Observation of prior light emission before arcing development in a low-temperature plasma with multiple snapshot analysis
S Kim, Y Lee, C Cho, M Choi, I Seong, J Lee, D Kim, S You
Scientific Reports 12 (1), 20976, 2022
42022
Development of a Noninvasive Real-Time Ion Energy Distribution Monitoring System Applicable to Collisional Plasma Sheath
I Seong, S Kim, Y Lee, C Cho, J Lee, W Jeong, Y You, S You
Sensors 22 (16), 6254, 2022
42022
Development of the Measurement of Lateral Electron Density (MOLE) Probe Applicable to Low-Pressure Plasma Diagnostics
S Kim, S Lee, Y You, Y Lee, I Seong, C Cho, J Lee, S You
Sensors 22 (15), 5487, 2022
42022
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Articles 1–20