| The seepage and stability performance assessment of a new drainage system to increase the height of a tailings dam C Liu, Z Shen, L Gan, L Xu, K Zhang, T Jin Applied Sciences 8 (10), 1840, 2018 | 23 | 2018 |
| Phase‐field modeling of rock fractures with roughness F Fei, J Choo, C Liu, JA White International Journal for Numerical and Analytical Methods in Geomechanics …, 2022 | 18 | 2022 |
| A hybrid finite volume and extended finite element method for hydraulic fracturing with cohesive crack propagation in quasi-brittle materials C Liu, Z Shen, L Gan, T Jin, H Zhang, D Liu Materials 11 (10), 1921, 2018 | 8 | 2018 |
| Coefficients of Reaction‐Diffusion Processes Derived From Patterns in Rocks C Liu, VM Calo, K Regenauer‐Lieb, M Hu Journal of Geophysical Research: Solid Earth 128 (5), e2022JB026253, 2023 | 7 | 2023 |
| Time series prediction model of slope displacement based on support vector machines-wavelet neural network T Jiang, ZZ Shen, LQ Xu Engineering Journal of Wuhan University 50 (2), 174-181, 2017 | 4 | 2017 |
| Liesegang patterns interpreted as a chemo-hydromechanical instability C Liu, M Hu, K Regenauer-Lieb International Workshop on Bifurcation and Degradation in Geomaterials, 59-66, 2022 | 3 | 2022 |
| Dendritic growth patterns in rocks: Inverting the driving and triggering mechanisms C Liu, VM Calo, K Regenauer‐Lieb, M Hu Journal of Geophysical Research: Solid Earth 128 (9), e2023JB027105, 2023 | 2 | 2023 |
| A time series prediction model of high slope displacement based on support vector machine and Elman neural network C LIU, Z SHEN, L GAN, C DANZENG, Z YAN Journal of Yangtze River Scientific Research Institute 36 (5), 62, 2019 | 2 | 2019 |
| Deriving flow velocity and initial concentration from Liesegang-like patterns C Liu, V Calo, K Regenauer-Lieb, M Hu Authorea Preprints, 2024 | | 2024 |
| A new mechanism for mineralizing systems based on cnoidal wave instabilities C Liu, V Calo, L Tannock, K Regenauer-Lieb, M Hu Authorea Preprints, 2023 | | 2023 |
Manman HuUniversity of Hong KongVerified email at hku.hk
