| Sequential Vce(T) Method for the Accurate Measurement of Junction Temperature Distribution Within Press-Pack IGBTs Y Zhang, E Deng, Z Zhao, J Chen, Y Zhao, J Guo, X Cui IEEE Transactions on Power Electronics 36 (4), 3735-3743, 2020 | 22 | 2020 |
| A physical thermal network model of press pack IGBTs considering spreading and coupling effects Y Zhang, E Deng, Z Zhao, S Fu, X Cui IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 17 | 2020 |
| Research on the multiphysics field-circuit coupling model of press pack IGBT considering the application of hybrid HVDC breakers E Deng, O Wenzel, Z Zhao, Y Zhang, X Ying, J Li, Y Huang IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (4 …, 2020 | 13 | 2020 |
| Experimental Verification of the Junction Temperature Distribution within Press Pack IGBTs Y Zhang, E Deng, Z Zhao, J Chen, S Fu, X Cui 2020 32nd International Symposium on Power Semiconductor Devices and ICs …, 2020 | 4 | 2020 |
| 压接型 IGBT 器件封装内部多物理场耦合问题研究概述 张一鸣， 邓二平， 赵志斌， 崔翔， 唐新灵， 傅实， 李金元 中国电机工程学报 39 (21), 6351-6365, 2019 | 3 | 2019 |
| Prestressed method to improve the pressure distribution uniformity within press pack IGBTs X Zhang, C Sai, L Li, Y Zhang 2020 4th International Conference on HVDC (HVDC), 880-883, 2020 | 1 | 2020 |
