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3D heterogeneous and flexible package integration for zero-power wireless neural recording SYB Sayeed, SB Venkatakrishnan, MM Monshi, A Abdulhameed, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1003-1009, 2020 | 3 | 2020 |
Wearable, epidermal devices for assessment of swallowing function T Rafeedi, A Abdal, B Polat, KA Hutcheson, EH Shinn, DJ Lipomi npj Flexible Electronics 7 (1), 52, 2023 | 2 | 2023 |
Selected Nanotechnology Advances in Interconnections Power RF and Sensor Integration-A View from ECTC 2022 TC Huang, A Watanabe, A Zinn, A Abdal, PM Raj IEEE EPS e-Newsletter, 2022 | 1 | 2022 |
Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications A Hassan, S Soroushiani, A Abdal, SYB Sayeed, WC Lin, MR Pulugurtha IEEE Open Journal of Nanotechnology 3, 52-60, 2022 | 1 | 2022 |
Recent advances in implantable medical systems with highly-heterogeneous integration A Abdal, A Hassan, PM Raj ADVANCING MICROELECTRONICS MAGAZINE 47 (6), 12-21, 2021 | 1 | 2021 |
Silver-free intrinsically conductive adhesives for shingled solar cells AX Chen, NA Azpiroz, SE Brew, AM Valdez, GL Esparza, Y Qie, ... Cell Reports Physical Science, 2024 | | 2024 |
High-Density Heterogeneous Integration for Implantable Electronic Systems PMR Abdulhameed Abdal, Akeeb Hassan IMAPS Advacing Microelectronics 47 (6), 2021 | | 2021 |
2022 Index IEEE Open Journal of Nanotechnology Vol. 3 A Abdal, L Bai, AA Balandin, F Bashir, HA Bhat, R Bhat, N Bindal, ... | | |