| Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) KJ Kanarik, J Marks, H Singh, S Tan, A Kabansky, W Yang, KIM Taeseung, ... US Patent 9,576,811, 2017 | 306 | 2017 |
| Dry plasma etch method to pattern MRAM stack S Tan, KIM Taeseung, W Yang, J Marks, T Lill US Patent 9,806,252, 2017 | 102 | 2017 |
| Directional etch of magnetic and noble metals. II. Organic chemical vapor etch JKC Chen, ND Altieri, T Kim, E Chen, T Lill, M Shen, JP Chang Journal of Vacuum Science & Technology A 35 (5), 2017 | 65 | 2017 |
| Dry plasma etch method to pattern MRAM stack S Tan, KIM Taeseung, W Yang, J Marks, T Lill US Patent 10,374,144, 2019 | 42 | 2019 |
| Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) KJ Kanarik, J Marks, H Singh, S Tan, A Kabansky, W Yang, KIM Taeseung, ... US Patent 9,805,941, 2017 | 39 | 2017 |
| Thermal chemistry of Cu (I)-iminopyrrolidinate and Cu (I)-guanidinate atomic layer deposition (ALD) precursors on Ni (110) single-crystal surfaces T Kim, Y Yao, JP Coyle, ST Barry, F Zaera Chemistry of Materials 25 (18), 3630-3639, 2013 | 36 | 2013 |
| Atomic layer etching of tungsten and other metals W Yang, S Tan, KJ Kanarik, J Marks, KIM Taeseung, M Shen, T Lill US Patent 10,096,487, 2018 | 32 | 2018 |
| Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch) KJ Kanarik, J Marks, H Singh, S Tan, A Kabansky, W Yang, KIM Taeseung, ... US Patent 10,186,426, 2019 | 28 | 2019 |
| Atomic layer etching for enhanced bottom-up feature fill S Tan, KIM Taeseung, J Yu, P Nalla, N Tjokro, A Kolics, KJ Kanarik US Patent 9,837,312, 2017 | 24 | 2017 |
| X-ray-initiated metal-promoted thin film growth T Kim, F Zaera The Journal of Physical Chemistry C 116 (15), 8594-8600, 2012 | 21 | 2012 |
| Surface chemistry of pentakis (dimethylamido) tantalum on Ta surfaces T Kim, F Zaera The Journal of Physical Chemistry C 115 (16), 8240-8247, 2011 | 20 | 2011 |
| Threshold behavior in kinetic electron emission from oxide insulators HK Kim, TS Kim, J Lee, SK Jo Physical Review B 76 (16), 165434, 2007 | 17 | 2007 |
| Atomic layer etching of tantalum KJ Kanarik, KIM Taeseung US Patent 10,566,213, 2020 | 15 | 2020 |
| Elucidating the Surface Reaction Mechanisms During Atomic Layer Deposition of LixAlySizO by in Situ Fourier Transform Infrared Spectroscopy J Cho, T Kim, T Seegmiller, JP Chang The Journal of Physical Chemistry C 120 (22), 11837-11846, 2016 | 13 | 2016 |
| Directional etch of magnetic and noble metals. I. Role of surface oxidation states JKC Chen, ND Altieri, T Kim, T Lill, M Shen, JP Chang Journal of Vacuum Science & Technology A 35 (5), 2017 | 9 | 2017 |
| Dry plasma etch method to pattern MRAM stack S Tan, KIM Taeseung, W Yang, J Marks, T Lill US Patent 10,749,103, 2020 | 8 | 2020 |
| Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) KJ Kanarik, J Marks, H Singh, SSH Tan, A Kabansky, W Yang, ... US Patent 10,515,816, 2019 | 8 | 2019 |
| Atomic layer deposition of YMnO3 thin films JH Choi, C Pham, J Dorman, T Kim, JP Chang Journal of Magnetism and Magnetic Materials 498, 166146, 2020 | 6 | 2020 |
| Mechanistic study of atomic layer deposition of AlxSiyO thin film via in-situ FTIR spectroscopy J Cho, T Kim, T Seegmiller, JP Chang Journal of Vacuum Science & Technology A 33 (5), 2015 | 6 | 2015 |
| Interaction of D2 with Ti-Adsorbed Polyaniline and Implication for Hydrogen Storage TS Kim, KJ Kim, SK Jo, J Lee The Journal of Physical Chemistry B 112 (51), 16431-16436, 2008 | 6 | 2008 |
Francisco ZaeraUniversity of CaliforniaVerified email at ucr.edu
