| CFD analysis on discharge coefficient during non-Newtonian flows through orifice meter N Arun, S Malavarayan, M Kaushik International Journal of Engineering Science and Technology 2 (7), 3151-3164, 2010 | 35 | 2010 |
| Magnetic Inductor Arrays for Intel® Fully Integrated Voltage Regulator (FIVR) on 10th generation Intel® Core™ SoCs M Sankarasubramanian 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020 | 31 | 2020 |
| The effects of initial crack length on fracture characterization of rubbers using the J-Integral approach M Torabizadeh, ZA Putnam, M Sankarasubramanian, JC Moosbrugger, ... Polymer Testing 73, 327-337, 2019 | 23 | 2019 |
| Thermophysical and transport properties of blends of an ether-derivatized imidazolium ionic liquid and a Li+-based solvate ionic liquid Y Wang, M Turk, M Sankarasubramanian, A Srivatsa, D Roy, S Krishnan Journal of Material Science, 2017 | 16 | 2017 |
| Enhanced elastomer toughness and fracture properties imparted by chemically reactive flat nanoparticles M Sankarasubramanian, M Torabizadeh, ZA Putnam, JC Moosbrugger, ... Polymer Testing 78 (September 2019), 105932, 2019 | 12 | 2019 |
| Polyetheretherketone, hexagonal boron nitride, and tungsten carbide cobalt chromium composite coatings: Mechanical and tribological properties J Lebga-Nebane, M Sankarasubramanian, G Chojecki, B Ning, P Yuya, ... Journal of Applied Polymer Science, 2021 | 6 | 2021 |
| Encapsulant material containing fluorophores for in-situ visualization of stress in an organic package E Nofen, B Penmecha, A Krishnan, M Sankarasubramanian US Patent App. 16/017,464, 2019 | 6 | 2019 |
| Microelectronic structures including bridges OG Karhade, NA Deshpande, M Bhatia, S Agraharam, E Cetegen, ... US Patent 11,887,962, 2024 | 4 | 2024 |
| Magnetic mold material inductors for electronic packages K Dhane, M Sankarasubramanian, Y Min, WJ Lambert US Patent App. 16/226,745, 2020 | 4 | 2020 |
| Filler shape and surface chemistry effects on compressive strength, energy dissipation, and elastic recovery of HNBR elastomer nanocomposites M Sankarasubramanian Clarkson University, 2016 | 4 | 2016 |
| Filled elastomers with improved thermal and mechanical properties S Krishnan, M Sankarasubramanian, JC Moosbrugger, M Torabizadeh, ... US Patent 10,995,194, 2021 | 2 | 2021 |
| Magnetic core/shell particles for inductor arrays M Sankarasubramanian, Y Min, A Dani US Patent App. 16/642,806, 2020 | 2 | 2020 |
| Chip-scale package architectures containing a die back side metal and a solder thermal interface material SD Mahapatra, M Sankarasubramanian, S Howell, J Harper, M Modi US Patent 12,040,246, 2024 | 1 | 2024 |
| No-remelt solder enforcement joint B Shan, C Haobo, O Karhade, M Sankarasubramanian, D Xu, G Duan, ... US Patent App. 17/517,152, 2023 | 1 | 2023 |
| Substrate integrated inductor with composite magnetic resin layer M Sankarasubramanian, Y Min, AA Dani, K Radhakrishnan US Patent 11,335,616, 2022 | 1 | 2022 |
| Cover Image, Volume 138, Issue 21 JL Lebga‐Nebane, M Sankarasubramanian, G Chojecki, B Ning, PA Yuya, ... Journal of Applied Polymer Science 138 (21), 50670, 2021 | 1 | 2021 |
| Powder coating compositions for reducing friction and wear in high temperature and high pressure applications S Krishnan, J Lebga, M Sankarasubramanian, G Chojecki, D Rasmussen, ... US Patent App. 62/252,694, 2015 | 1 | 2015 |
| Integrated circuit die package stiffeners of metal alloys having exceptionally high cte V Ouvarov-Bancalero, J Harper, M Sankarasubramanian, P Nardi, ... US Patent App. 17/192,770, 2022 | | 2022 |
| Fundamentals of Polymer Additives J Patel, Y Schneider, M Sankarasubramanian, V Jayaram ASM Handbook 11, 2022 | | 2022 |
| Microelectronic structures including bridges M Sankarasubramanian US Patent App. 20,210/391,295, 2021 | | 2021 |
