| Cu Pillar with Nanocopper Caps: The Next Interconnection Node Beyond Traditional Cu Pillar RA Sosa, K Mohan, L Nguyen, R Tummala, A Antoniou, V Smet 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 655-660, 2019 | 10 | 2019 |
| Demonstration of Patternable All-Cu Compliant Interconnections with Enhanced Manufacturability in Chip-to-Substrate Applications K Mohan, N Shahane, R Sosa, S Khan, PM Raj, A Antoniou, V Smet, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 301-307, 2018 | 9 | 2018 |
| Low-temperature all-Cu interconnections formed by pressure-less sintering of Cu-pillars with nanoporous-Cu caps RA Sosa, K Mohan, A Antoniou, V Smet, D Thienpont, YY Tan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 390-394, 2021 | 4 | 2021 |
| Reliability and Failure Analysis of Chip-to-Substrate Cu-Pillar Interconnections with Nanoporous-Cu Caps RA Sosa, A Antoniou, V Smet 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 318-323, 2023 | 1 | 2023 |
| Titanium Dioxide As a High Capacity Anode for High Voltage Aqueous Lithium-Ion Batteries A Ramanujapuram, D Gordon, K Coffman, RA Sosa, S Zhang, G Yushin Meeting Abstracts, 101-101, 2016 | | 2016 |
