| Highly efficient dual band 2.45/5.85 GHz rectifier for RF energy harvesting applications in ISM band M ur Rehman, W Ahmad, WT Khan 2017 IEEE Asia Pacific Microwave Conference (APMC), 150-153, 2017 | 53 | 2017 |
| Characterization of ABF/glass/ABF substrates for mmWave applications M ur Rehman, S Ravichandran, AO Watanabe, S Erdogan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 31 | 2021 |
| W-band and D-band transmission lines on glass based substrates for sub-THz modules M ur Rehman, S Ravichandran, S Erdogan, M Swaminathan 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 660-665, 2020 | 23 | 2020 |
| Hybrid dual band radio frequency and solar energy harvesting system for making battery-less sensing nodes M Hamza, MU Rehman, A Riaz, Z Maqsood, WT Khan 2021 IEEE Radio and Wireless Symposium (RWS), 116-118, 2021 | 20 | 2021 |
| Design of SIW filters in D-band using invertible neural nets H Yu, HM Torun, MU Rehman, M Swaminathan 2020 IEEE/MTT-S International Microwave Symposium (IMS), 72-75, 2020 | 16 | 2020 |
| A highly efficient tri band (GSM1800, WiFi2400 and WiFi5000) rectifier for various radio frequency harvesting applications W Ahmad, MI Qureshi, WT Khan 2017 Progress in Electromagnetics Research Symposium-Fall (PIERS-FALL), 2039 …, 2017 | 15 | 2017 |
| Substrate integrated waveguide filters in glass interposer for mmWave applications M ur Rehman, LNV Kumar, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 12 | 2022 |
| Long range wireless power transfer via magnetic resonance I Khan, MI Qureshi, MU Rehman, WT Khan 2017 Progress in Electromagnetics Research Symposium-Fall (PIERS-FALL), 3079 …, 2017 | 9 | 2017 |
| Flexible and ultra-thin glass substrates for RF applications S Sivapurapu, R Chen, M ur Rehman, K Kanno, T Kakutani, M Letz, F Liu, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1638-1644, 2021 | 8 | 2021 |
| Characterization of alumina ribbon ceramic substrates for 5G and mm-Wave applications N Aslani-Amoli, M ur Rehman, F Liu, M Swaminathan, CG Zhuang, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 7 | 2022 |
| Substrate integrated waveguides in glass interposers for mm wave applications M ur Rehman, A Watanabe, S Ravichandran, M Swaminathan 2021 IEEE MTT-S International Microwave Symposium (IMS), 339-341, 2021 | 7 | 2021 |
| Radio frequency energy harvesting from ambient FM signals for making battery-less sensor nodes for wireless sensor networks MI Qureshi, W Ahmad, WT Khan 2017 IEEE Asia Pacific Microwave Conference (APMC), 487-490, 2017 | 7 | 2017 |
| Transmission lines on alumina ribbon ceramic substrate material for 30 to 170 GHz wireless applications N Aslani-Amoli, MU Rehman, S Sivapurapu, F Liu, M Swaminathan, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2272-2278, 2021 | 6 | 2021 |
| Packaging approaches for mm wave and sub-THz communication S Ravichandran, KQ Huang, M ur Rehman, S Erdogan, A Watanabe, ... 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems …, 2019 | 5 | 2019 |
| A compact high isolation wideband MIMO antenna for multi-band applications A Madni, MR Akram, K Riaz, HU Rahman, MU Rehman, WT Khan, ... Journal of Electromagnetic Waves and Applications 36 (14), 2041-2054, 2022 | 4 | 2022 |
| A compact low cost high isolation substrate integrated waveguide fed slot antenna array at 28 GHz employing beamforming and beam scanning for 5G applications JA Nasir, M ur Rehman, AJ Hashmi, WT Khan IET Digital Library, 2018 | 4 | 2018 |
| Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications N Aslani-Amoli, M ur Rehman, LNV Kumar, A Moradinia, F Liu, ... IEEE Microwave and Wireless Technology Letters, 2023 | 1 | 2023 |
| Highly efficient and low cost radio frequency rectifier for energy harvesting applications I Khan, W Ahmad, WT Khan 2017 Progress in Electromagnetics Research Symposium-Fall (PIERS-FALL), 2513 …, 2017 | 1 | 2017 |
| Air Filled SIWs using Laminate Dielectrics on Glass Substrate for D-band Applications M ur Rehman, LNV Kumar, S Erdogan, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Characterization of Microstrip line and SIW on ABF in Glass Interposers for mmWave Applications M ur Rehman, LNV Kumar, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | | 2023 |
