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Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial Professor在 stanford.edu 的电子邮件经过验证
H.-S. Philip WongProfessor of Electrical Engineering, Stanford University在 stanford.edu 的电子邮件经过验证
Feng XiongAssociate Professor, Department of Electrical and Computer Engineering, University of Pittsburgh在 pitt.edu 的电子邮件经过验证
David EstradaBoise State University; Idaho National Laboratory在 boisestate.edu 的电子邮件经过验证
Myung-Ho BaeKorea Research Institute of Standards and Science, mhbae@kriss.re.kr在 kriss.re.kr 的电子邮件经过验证
Eilam YalonTechnion, Israel Institute of Technology在 technion.ac.il 的电子邮件经过验证
Connor J. McClellanStanford University在 stanford.edu 的电子邮件经过验证
Ashkan BehnamDevice Engineer, Micron在 micron.com 的电子邮件经过验证
Krishna SaraswatProfessor of Electrical Engineering, Stanford University在 stanford.edu 的电子邮件经过验证
Joseph W. LydingProfessor of Electrical and Computer Engineering, University of Illinois在 illinois.edu 的电子邮件经过验证
Sanchit DeshmukhPhD, Stanford University在 alumni.stanford.edu 的电子邮件经过验证
Albert LiaoEmerging Memory Engineer, Micron在 micron.com 的电子邮件经过验证
Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, Singapore在 ihpc.a-star.edu.sg 的电子邮件经过验证
Dr. Miguel Muñoz Rojo - ERC granteeTenured permanent researcher (CSIC) & Associate Prof. (University of Twente)在 csic.es 的电子邮件经过验证
Hongjie DaiProfessor of chemistry, stanford university在 stanford.edu 的电子邮件经过验证
Joshua D. WoodPrincipal Solutions Engineer, Dynatrace在 dynatrace.com 的电子邮件经过验证
Saurabh V. SuryavanshiSynopsys在 suryavanshi.me 的电子邮件经过验证
Asir Intisar KhanPostdoc, UC Berkeley | Visiting Postdoc & PhD, EE, Stanford University在 berkeley.edu 的电子邮件经过验证
Alwin DausInstitute of Semiconductor Engineering, University of Stuttgart在 iht.uni-stuttgart.de 的电子邮件经过验证
Feifei LianStanford University在 stanford.edu 的电子邮件经过验证