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Kenneth M C CheungChair Professor, Department of Orthopaedics and Traumatology, University of Hong KongVerified email at hku.hk
Kelvin YeungDepartment of Orthopaedics and Traumatology, The University of Hong KongVerified email at hku.hk
Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongVerified email at cityu.edu.hk
Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
Shuilin WUTianjin UniversityVerified email at tju.edu.cn
Chiu KYThe University of Hong KongVerified email at hku.hk
Yong HuUniversity of Hong KongVerified email at ortho.hku.hk
A.H.W. NganUniversity of Hong KongVerified email at hku.hk
Victor Yu-Leong LeungOrthopaedics & Traumatology, The University of Hong KongVerified email at hku.hk
Xuanyong LiuProfessor of Shanghai Institute of Ceramics, Chinese Academy of SciencesVerified email at mail.sic.ac.cn
Songlin PengShenzhen People's Hospital, Jinan University School of MedicineVerified email at usc.edu
Wenguang Liu (刘文广)Professor of Materials Science, Tianjin UniversityVerified email at tju.edu.cn
Zuqing Zhu (朱祖勍)FIEEE, Professor, University of Science and Technology of China; Cisco; UC DavisVerified email at ustc.edu.cn
chunyi wenThe Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Feng ZhaoTexas A&M UniversityVerified email at tamu.edu
Ting WangProfessor of School of Biological Science and Medical EngineeringVerified email at seu.edu.cn
Bing XuBrandeis UniversityVerified email at brandeis.edu
Tang BSouthern University of Science and TechnologyVerified email at sustc.edu.cn
X. Edward GuoStanley Dicker Professor and Chair of Biomedical Engineering, Columbia UniversityVerified email at columbia.edu