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Linghan Chen
Linghan Chen
Department of Materials Science, Tohoku University
在 dc.tohoku.ac.jp 的电子邮件经过验证
标题
引用次数
引用次数
年份
Three-dimensional bicontinuous nanoporous materials by vapor phase dealloying
Z Lu, C Li, J Han, F Zhang, P Liu, H Wang, Z Wang, C Cheng, L Chen, ...
Nature communications 9 (1), 276, 2018
1492018
Correlation between chemical dopants and topological defects in catalytically active nanoporous graphene
Y Ito, Y Shen, D Hojo, Y Itagaki, T Fujita, L Chen, T Aida, Z Tang, ...
Advanced Materials 28 (48), 10644-10651, 2016
1192016
Cooperation between holey graphene and NiMo alloy for hydrogen evolution in an acidic electrolyte
Y Ito, T Ohto, D Hojo, M Wakisaka, Y Nagata, L Chen, K Hu, M Izumi, ...
ACS Catalysis 8 (4), 3579-3586, 2018
1072018
Heavily Doped and Highly Conductive Hierarchical Nanoporous Graphene for Electrochemical Hydrogen Production
L Chen, J Han, Y Ito, T Fujita, G Huang, K Hu, A Hirata, K Watanabe, ...
Angewandte Chemie International Edition 57 (40), 13302-13307, 2018
762018
Graphene Layer Encapsulation of Non-Noble Metal Nanoparticles as Acid-Stable Hydrogen Evolution Catalysts
K Hu, T Ohto, L Chen, J Han, M Wakisaka, Y Nagata, J Fujita, Y Ito
ACS Energy Letters 3 (7), 1539–1544, 2018
612018
NiAl as a potential material for liner-and barrier-free interconnect in ultrasmall technology node
L Chen, D Ando, Y Sutou, D Gall, J Koike
Applied Physics Letters 113 (18), 2018
402018
CuAl2 thin films as a low-resistivity interconnect material for advanced semiconductor devices
L Chen, D Ando, Y Sutou, J Koike
Journal of Vacuum Science & Technology B 37 (3), 2019
292019
Interdiffusion reliability and resistivity scaling of intermetallic compounds as advanced interconnect materials
L Chen, S Kumar, M Yahagi, D Ando, Y Sutou, D Gall, R Sundararaman, ...
Journal of Applied Physics 129 (3), 2021
232021
Liner-and barrier-free NiAl metallization: A perspective from TDDB reliability and interface status
L Chen, D Ando, Y Sutou, S Yokogawa, J Koike
Applied Surface Science 497, 143810, 2019
162019
Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges
L Chen, Q Chen, D Ando, Y Sutou, M Kubo, J Koike
Applied Surface Science 537, 148035, 2020
152020
Intermetallic Compounds For Interconnect Metal Beyond 3 nm Node
J Koike, T Kuge, L Chen, M Yahagi
2021 IEEE International Interconnect Technology Conference (IITC), 1-3, 2021
32021
Possibility of Cu2Mg for Liner-Barrier Free Interconnects
L Chen, D Ando, Y Sutou, M Yahagi, J Koike
2020 IEEE International Interconnect Technology Conference (IITC), 85-87, 2020
12020
Possibility of intermetallic compounds for ultra-small scale interconnections
J Koike, L Chen, S Yokogawa
IEICE Technical Report; IEICE Tech. Rep. 119 (410), 25-25, 2020
2020
招待講演 NiAl as Cu alternative for ultrasmall feature sizes (シリコン材料·デバイス)
L Chen, J Koike, D Ando, Y Sutou
電子情報通信学会技術研究報告= IEICE technical report: 信学技報 119 (239), 29-33, 2019
2019
NiAl as Cu alternative for ultrasmall feature sizes
L Chen, J Koike, D Ando, Y Sutou
IEICE Technical Report; IEICE Tech. Rep. 119 (239), 29-33, 2019
2019
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