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- David W. FlahertyGeorgia Institute of TechnologyVerified email at gatech.edu
- Daniel T. BreganteVP of Engineering @ SiTration, Inc.Verified email at sitration.com
- Jeremiah A. JohnsonMITVerified email at mit.edu
- Keith E L HustedPhD Student, Massachusetts Institute of TechnologyVerified email at mit.edu
- Michael CordonPurdue UniversityVerified email at purdue.edu
- Rajamani GounderPurdue UniversityVerified email at purdue.edu
- Brandon C. BukowskiJohns Hopkins University, Chemical and Biomolecular EngineeringVerified email at jhu.edu
- E. Zeynep AylaEngineering Systems Inc.Verified email at engsys.com
- Jeffrey GreeleyPurdue UniversityVerified email at purdue.edu
- Elisabeth PrinceUniversity of WaterlooVerified email at uwaterloo.ca
- Peyton ShiehVerified email at mit.edu
- Gavin R. KielQuadratic 3D, Inc.Verified email at MIT.edu
- Valerie LenschMassachusetts Institute of TechnologyVerified email at mit.edu
- Nancy SottosUniversity of Illinois Urbana-ChampaignVerified email at illinois.edu
- Douglas IvanoffMaterials ScientistVerified email at formlabs.com
- Aoon RizviStanford UniversityVerified email at stanford.edu
- Hsuan-Chin WangUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Manuel A. OrtuñoUniversidad de AlicanteVerified email at ua.es
- Christopher J. CramerUL Research InstitutesVerified email at ul.org
- James J. PerkinsMerck and CompanyVerified email at merck.com