| Overview of constitutive laws, kinematics, homogenization and multiscale methods in crystal plasticity finite-element modeling: Theory, experiments, applications F Roters, P Eisenlohr, L Hantcherli, DD Tjahjanto, TR Bieler, D Raabe Acta materialia 58 (4), 1152-1211, 2010 | 1825 | 2010 |
| The effect of alpha platelet thickness on plastic flow during hot working of Ti–6Al–4V with a transformed microstructure SL Semiatin, TR Bieler Acta materialia 49 (17), 3565-3573, 2001 | 481 | 2001 |
| The role of heterogeneous deformation on damage nucleation at grain boundaries in single phase metals TR Bieler, P Eisenlohr, F Roters, D Kumar, DE Mason, MA Crimp, ... International Journal of Plasticity 25 (9), 1655-1683, 2009 | 365 | 2009 |
| Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints TR Bieler, H Jiang, LP Lehman, T Kirkpatrick, EJ Cotts, B Nandagopal IEEE Transactions on Components and Packaging Technologies 31 (2), 370-381, 2008 | 355 | 2008 |
| Superplasticity in powder metallurgy aluminum alloys and composites RS Mishra, TR Bieler, AK Mukherjee Acta metallurgica et materialia 43 (3), 877-891, 1995 | 311 | 1995 |
| Crystal plasticity finite element methods: in materials science and engineering F Roters, P Eisenlohr, TR Bieler, D Raabe John Wiley & Sons, 2011 | 290 | 2011 |
| The origins of heterogeneous deformation during primary hot working of Ti–6Al–4V TR Bieler, SL Semiatin International Journal of Plasticity 18 (9), 1165-1189, 2002 | 277 | 2002 |
| Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging S Choi, TR Bieler, JP Lucas, KN Subramanian Journal of Electronic Materials 28, 1209-1215, 1999 | 274 | 1999 |
| Twin nucleation by slip transfer across grain boundaries in commercial purity titanium L Wang, Y Yang, P Eisenlohr, TR Bieler, MA Crimp, DE Mason Metallurgical and Materials Transactions A 41 (2), 421, 2010 | 257 | 2010 |
| Grain boundaries and interfaces in slip transfer TR Bieler, P Eisenlohr, C Zhang, HJ Phukan, MA Crimp Current Opinion in Solid State and Materials Science 18 (4), 212-226, 2014 | 240 | 2014 |
| Effects of working, heat treatment, and aging on microstructural evolution and crystallographic texture of α, α′, α ″and β phases in Ti–6Al–4V wire L Zeng, TR Bieler Materials Science and Engineering: A 392 (1-2), 403-414, 2005 | 229 | 2005 |
| Cyclic twin nucleation in tin-based solder alloys LP Lehman, Y Xing, TR Bieler, EJ Cotts Acta Materialia 58 (10), 3546-3556, 2010 | 198 | 2010 |
| Methodology for estimating the critical resolved shear stress ratios of α-phase Ti using EBSD-based trace analysis H Li, DE Mason, TR Bieler, CJ Boehlert, MA Crimp Acta Materialia 61 (20), 7555-7567, 2013 | 193 | 2013 |
| Orientation informed nanoindentation of α-titanium: Indentation pileup in hexagonal metals deforming by prismatic slip C Zambaldi, Y Yang, TR Bieler, D Raabe Journal of Materials Research 27 (1), 356-367, 2012 | 177 | 2012 |
| Nucleation of paired twins at grain boundaries in titanium L Wang, P Eisenlohr, Y Yang, TR Bieler, MA Crimp Scripta Materialia 63 (8), 827-830, 2010 | 174 | 2010 |
| Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys AU Telang, TR Bieler, JP Lucas, KN Subramanian, LP Lehman, Y Xing, ... Journal of electronic materials 33, 1412-1423, 2004 | 156 | 2004 |
| Effect of texture and slip mode on the anisotropy of plastic flow and flow softening during hot working of Ti-6Al-4V SL Semiatin, TR Bieler Metallurgical and Materials Transactions A 32, 1787-1799, 2001 | 153 | 2001 |
| Superplastic-like behavior at high strain rates in mechanically alloyed aluminum TR Bieler, TG Nieh, J Wadsworth, AK Mukherjee Scripta metallurgica 22 (1), 81-86, 1988 | 142 | 1988 |
| Flow softening during hot working of Ti-6Al-4V with a lamellar colony microstructure RM Miller, TR Bieler, SL Semiatin Scripta materialia 40 (12), 1387-1393, 1999 | 140 | 1999 |
| Processing and aging characteristics of eutectic Sn-3.5 Ag solder reinforced with mechanically incorporated Ni particles F Guo, J Lee, S Choi, JP Lucas, TR Bieler, KN Subramanian Journal of Electronic Materials 30, 1073-1082, 2001 | 135 | 2001 |
Philip EisenlohrAssociate Professor, Chemical Engineering and Materials Science, Michigan State University在 egr.msu.edu 的电子邮件经过验证
