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Francesco CiucciThe Hong Kong University of Science and TechnologyVerified email at ust.hk
Jiang CuiUniversity of Texas at Austin, Clemson University, Hong Kong University of Science and TechnologyVerified email at austin.utexas.edu
Junxiong WUHong Kong Polytechnic University, Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
Shanshan YaoUT Austin, BNL, HKUSTVerified email at utexas.edu
Mohammed B. EffatAssiut University, Egypt-Hong Kong University of Science and Technology, Hong Kong.Verified email at aun.edu.eg
Jiapeng LiuThe Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
Chi ChenMicrosoft QuantumVerified email at microsoft.com
Yang GaoCollege of Materials Science and Engineering, Hunan UniversityVerified email at hnu.edu.cn
Baohua LiProfessor, Graduate School at Shenzhen, Tsinghua UniversityVerified email at mail.sz.tsinghua.edu.cn
Haoran JIANG (蒋浩然)Professor, Tianjin UniversityVerified email at tju.edu.cn
T.S. Zhao 赵天寿Chair Professor, SUSTechVerified email at sustech.edu.cn
Chris J. PickardSir Alan Cottrell Professor of Materials Science, University of CambridgeVerified email at cam.ac.uk
Biao ZHANGThe Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Jian WangSNUVerified email at snu.ac.kr
Ting Hei WanThe Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
Dengjie ChenJinan UniversityVerified email at jnu.edu.cn
Chunming NiuVerified email at mail.xjtu.edu.cn
Zhao CaiHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Yongming Sun/孙永明Huazhong University of Science and TechnologyVerified email at hust.edu.cn
Partha P. MukherjeeProfessor of Mechanical Engineering, Purdue UniversityVerified email at purdue.edu