| Mapping the world’s free-flowing rivers G Grill, B Lehner, M Thieme, B Geenen, D Tickner, F Antonelli, S Babu, ... Nature 569 (7755), 215-221, 2019 | 1752 | 2019 |
| Solid State Sci J Ecs Technol 2, P311, 2013 | 362 | 2013 |
| Quasiparticle interaction in liquid 3He S Babu, GE Brown Annals of Physics 78 (1), 1-38, 1973 | 311 | 1973 |
| Excimer laser etching of polymers V Srinivasan, MA Smrtic, SV Babu Journal of applied physics 59 (11), 3861-3867, 1986 | 302 | 1986 |
| Modification of the Preston equation for the chemical–mechanical polishing of copper Q Luo, S Ramarajan, SV Babu Thin solid films 335 (1-2), 160-167, 1998 | 245 | 1998 |
| Metallized Plastics KL Mittal, JR Susko Electrochemical Society Symposium on Metallized Plastics, 2001 | 234 | 2001 |
| Advances in chemical mechanical planarization (CMP) B Suryadevara Woodhead Publishing, 2016 | 205 | 2016 |
| Hydroxyl Radical Formation in H 2 O 2‐Amino Acid Mixtures and Chemical Mechanical Polishing of Copper M Hariharaputhiran, J Zhang, S Ramarajan, JJ Keleher, Y Li, SV Babu Journal of the Electrochemical Society 147 (10), 3820, 2000 | 177 | 2000 |
| Chemical mechanical polishing of thermal oxide films using silica particles coated with ceria SH Lee, Z Lu, SV Babu, E Matijević Journal of materials Research 17 (10), 2744-2749, 2002 | 160 | 2002 |
| Chemical–mechanical polishing of copper in alkaline media Q Luo, DR Campbell, SV Babu Thin Solid Films 311 (1-2), 177-182, 1997 | 154 | 1997 |
| Colloid aspects of chemical–mechanical planarization E Matijević, SV Babu Journal of colloid and interface science 320 (1), 219-237, 2008 | 123 | 2008 |
| Effect of pH on CMP of copper and tantalum A Jindal, SV Babu Journal of the Electrochemical Society 151 (10), G709, 2004 | 120 | 2004 |
| Copper dissolution in aqueous ammonia-containing media during chemical mechanical polishing Q Luo, RA Mackay, SV Babu Chemistry of materials 9 (10), 2101-2106, 1997 | 120 | 1997 |
| Shallow trench isolation chemical mechanical planarization: a review R Srinivasan, PVR Dandu, SV Babu ECS Journal of Solid State Science and Technology 4 (11), P5029, 2015 | 116 | 2015 |
| Achievement of high planarization efficiency in CMP of copper at a reduced down pressure S Pandija, D Roy, SV Babu Microelectronic Engineering 86 (3), 367-373, 2009 | 104 | 2009 |
| Cobalt polishing with reduced galvanic corrosion at copper/cobalt interface using hydrogen peroxide as an oxidizer in colloidal silica-based slurries BC Peethala, HP Amanapu, URK Lagudu, SV Babu Journal of The Electrochemical Society 159 (6), H582, 2012 | 101 | 2012 |
| Synergistic roles of dodecyl sulfate and benzotriazole in enhancing the efficiency of CMP of copper Y Hong, VK Devarapalli, D Roy, SV Babu Journal of the Electrochemical Society 154 (6), H444, 2007 | 100 | 2007 |
| Relative roles of H 2 O 2 and glycine in CMP of copper studied with impedance spectroscopy J Lu, JE Garland, CM Pettit, SV Babu, D Roy Journal of the Electrochemical Society 151 (10), G717, 2004 | 100 | 2004 |
| Chemical mechanical polishing using mixed abrasive slurries A Jindal, S Hegde, SV Babu Electrochemical and Solid-State Letters 5 (7), G48, 2002 | 100 | 2002 |
| Citric acid as a complexing agent in CMP of copper: Investigation of surface reactions using impedance spectroscopy VRK Gorantla, KA Assiongbon, SV Babu, D Roy Journal of the Electrochemical Society 152 (5), G404, 2005 | 97 | 2005 |
