| Application of Aloe vera gel instead of silicon dioxide as organic dielectric material in microelectronics SM Rana, R Al Amin, A Uz-Zaman, SH Talukder, NH Mia, S Tayyaba, ... Materials Science-Poland 33 (3), 635-638, 2015 | 7 | 2015 |
| Introducing Pico Hydro from Daily Used Water and Rain Water R Al Amin, SH Talukder International Journal of Engineering Research and Applications 4 (1-2), 382-385, 2014 | 7 | 2014 |
| Simulation Analysis of Capacitive Pressure Sensor for MEMS Using Graphene R Al Amin, SM Rana, MS Iqbal, ASR Rishad, MT Rayhan, M Hoq, MH Ali International Conference on Materials, Electronics Information Engineering …, 2015 | 4 | 2015 |
| Simulation of Aloe vera Gel as Organic Dielectric Material in Microelectronics Instead of SiO2 (Silicon Dioxide) RA Amin, SM Rana, SH Talukder, MS Iqbal, M Anzan-Uz-Z, M Hoq Journal of Applied Sciences 14 (24), 3507-3513, 2014 | 3 | 2014 |
| Simulation of mono layer solar cell using COMSOL and fabrication in particle controlled BAEC clean room MRH Rajib, SM Rana, MR Hasan, R Amin, MS Iqbal, MRK Anik, ... International Journal of Engineering Research and Technology (IJERT) 3 (6), 2014 | 3 | 2014 |
| Architecture of IoT-Based Collaborative Laboratory for Reconfigurable SoC: Review and Development R Al Amin, V Wiese, MM Rahman, S Jacobs, S Jaschke, R Obermaisser 2023 IEEE 2nd German Education Conference (GECon), 1-6, 2023 | 1 | 2023 |
| FPGA-based Real-Time Object Detection and Classification System using YOLO for Edge Computing R Al Amin, M Hasan, V Wiese, R Obermaisser IEEE Access, 2024 | | 2024 |
| Functional Safety of a System-on-Chip Based Safety-Critical Structural Health Monitoring System V Wiese, R Al Amin, R Obermaisser 2022 6th International Conference on System Reliability and Safety (ICSRS …, 2022 | | 2022 |
| Design and Evaluation of Guided Wave Signal Generation for System-On-Chip Platform on FPGA V Wiese, R Al Amin, R Obermaisser IECON 2022–48th Annual Conference of the IEEE Industrial Electronics Society …, 2022 | | 2022 |
Roman ObermaisserProfessor for Embedded Systems, University of SiegenVerified email at uni-siegen.de
