| Advanced Package FA flow for next-gen packaging technology using EOTPR, 3D XRAY & Plasma FIB C Schmidt, PS Pichumani, J Alton, M Igarashi, L Chan, E Principe International Symposium for Testing and Failure Analysis 42, 439-443, 2016 | 10 | 2016 |
| One-pot ternary sequential reactions for photopatterned gradient multimaterials S Huang, SM Adelmund, PS Pichumani, JJ Schwartz, Y Mengüç, ... Matter 6 (7), 2419-2438, 2023 | 8 | 2023 |
| ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis: November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA. ASM International ASM International, 2012 | 6* | 2012 |
| Chemical and physical properties of tribofilms formed by the interaction of ashless dithiophosphate anti‐wear additives K Vyavhare, S Bagi, PS Pichumani, V Sharma, PB Aswath Lubrication Science 33 (4), 188-200, 2021 | 4 | 2021 |
| A Simple Method to Decouple Redeposition-Related Artifacts from Real Defects in the Failure Analysis of Silicon Photonics Modules F Khatkhatay, PS Pichumani Microscopy and Microanalysis 25 (S2), 726-727, 2019 | 2 | 2019 |
| Benefits of Using a CF4-Free Microwave Induced Plasma (MIP) Spot Etch Process to Remove Underfill and Analyze 2.5 D Modules K Distelhurst, J Myers, D Bader, R Russotti, P Pichumani, J Tang, ... ISTFA 2020, 226-232, 2020 | 1 | 2020 |
| Mechanical milling and polishing of cross sections using a micro CNC machine for failure analysis PS Pichumani, F Khatkhatay Electron Device Fail Anal 22 (1), 14-19, 2020 | 1 | 2020 |
| Challenges in Failure Analysis of 3D Bonded Wafers PS Pichumani, T Atanasova, F Baumann, M Hatzistergos, J Mody, S Molis, ... ISTFA 2018, 1-7, 2018 | 1 | 2018 |
| Liquid crystal based metasurfaces for optical systems, methods, and devices PS Pichumani, S Rekhi, TJF Wallin US Patent 11,796,819, 2023 | | 2023 |
| System and method for integrated circuit (ic) nanometer range interconnect fabrication PS Pichumani, S Rekhi, A Byagowi US Patent App. 17/702,293, 2023 | | 2023 |
| Flex bonded integrated circuits S Rekhi, PS Pichumani US Patent App. 17/698,134, 2023 | | 2023 |
| Vertical polishing system with multiple degrees of freedom S Rekhi, PS Pichumani US Patent 11,756,814, 2023 | | 2023 |
| Nanophotonic crack stop design PS Pichumani, S Rekhi US Patent App. 17/688,716, 2023 | | 2023 |
| Euv lithography using polymer crystal based reticle PS Pichumani, S Rekhi, TJF Wallin US Patent App. 17/961,164, 2023 | | 2023 |
| Multi-angle sample holder with integrated micromanipulator PS Pichumani, S Rekhi, HL Davidson US Patent 11,604,212, 2023 | | 2023 |
| Complex photonics circuit fabrication PS Pichumani, S Rekhi US Patent App. 17/392,862, 2023 | | 2023 |
| One-Pot Printing of Robust Multimaterial Devices S Huang, S Adelmund, PS Pichumani, JJ Schwartz, Y Menguc, M Shusteff, ... arXiv preprint arXiv:2111.10521, 2021 | | 2021 |
| Innovative Grounding Methodology for Epoxy Impregnated Semiconductor Cross Sections for Electron Microscopy Inspection F Baumann, PS Pichumani, C Torcedo Microscopy and Microanalysis 26 (S2), 370-372, 2020 | | 2020 |
| Innovative Puck Design for the Mechanical Cross-Sectioning and Subsequent Analysis of Semiconductor Packaged Samples in Failure Analysis F Khatkhatay, PS Pichumani EDFA Technical Articles 22 (2), 4-12, 2020 | | 2020 |
| Introduction of a Novel Sample Preparation Technique for the Failure Analysis of Silicon Integrated Photonics Modules PS Pichumani, F Khatkhatay ISTFA 2019, 2019 | | 2019 |
