Yiu Ming Cheung
Yiu Ming Cheung
ASM Techology Hong Kong
Verified email at ieee.org
Title
Cited by
Cited by
Year
Warpage and thermal characterization of fan-out wafer-level packaging
JH Lau, M Li, D Tian, N Fan, E Kuah, W Kai, M Li, J Hao, YM Cheung, Z Li, ...
IEEE transactions on components, packaging and manufacturing technology 7 K, 2017
932017
Optical nonlinearities of tea studied by Z-scan and four-wave mixing techniques
YM Cheung, SK Gayen
JOSA B 11 (4), 636-643, 1994
701994
Excited-state absorption in Pr 3+: Y 3 Al 5 O 12
YM Cheung, SK Gayen
Physical Review B 49 (21), 14827, 1994
671994
Two-photon excitation of the lowest 44f5d near-ultraviolet transitions in :
SK Gayen, BQ Xie, YM Cheung
Physical review B 45 (1), 20, 1992
541992
Fan-out wafer-level packaging for heterogeneous integration
JH Lau, M Li, ML Qingqian, T Chen, I Xu, QX Yong, Z Cheng, N Fan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 K, 2018
432018
Design, materials, process, fabrication, and reliability of fan-out wafer-level packaging
JH Lau, M Li, QM Li, I Xu, T Chen, Z Li, KH Tan, QX Yong, Z Cheng, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (6 K, 2018
422018
Chip-first fan-out panel-level packaging for heterogeneous integration
CT Ko, H Yang, JH Lau, M Li, M Li, C Lin, JW Lin, T Chen, I Xu, CL Chang, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 K, 2018
392018
Effect of electrode pattern on the outputs of piezosensors for wire bonding process control
SS Chiu, HLW Chan, SW Or, YM Cheung, PCK Liu
Materials Science and Engineering: B 99 (1-3), 121-126, 2003
352003
Fan-out wafer-level packaging (FOWLP) of large chip with multiple redistribution layers (RDLs)
J Lau, M Li, N Fan, E Kuah, Z Li, KH Tan, T Chen, I Xu, M Li, YM Cheung, ...
Journal of Microelectronics and Electronic Packaging 14 (4), 123-131, 2017
322017
Apparatus for semiconductor chip detachment
YM Cheung, CK Liu, CH Yiu, CM Chong
US Patent 7,240,422, 2007
282007
Thermal compression bonding of semiconductor chips
YM Cheung, TYP Lo, M Li, YH Mak, K San LAM
US Patent 8,967,452, 2015
232015
Vibration-induced die detachment system
YM Cheung, MK Chow
US Patent 7,757,742, 2010
232010
Pick and place assembly for transporting a film of material
YM Cheung, CM Chong
US Patent 7,182,118, 2007
212007
Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding
YH Chan, JK Kim, D Liu, PCK Liu, YM Cheung, MW Ng
IEEE transactions on advanced packaging 28 (4), 674-684, 2005
212005
Piezoelectric sensor for measuring bonding parameters
LW Chan-Wong, S San Chiu, SW Or, YM Cheung
US Patent 6,279,810, 2001
202001
Finite element stress analysis of thin die detachment process
ACM Chong, YM Cheung
Fifth International Conference onElectronic Packaging Technology Proceedings K, 2003
182003
A high throughput and reliable thermal compression bonding process for advanced interconnections
M Li, DW Tian, YM Cheung, L Yang, JH Lau
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 603-608, 2015
162015
Reliability of fan-out wafer-level heterogeneous integration
J Lau, M Li, Y Lei, M Li, I Xu, T Chen, QX Yong, Z Cheng, W Kai, P Lo, Z Li, ...
International Symposium on Microelectronics 2018 (1), 000224-000232, 2018
152018
Determination of the interfacial fracture toughness of laminated silicon die on adhesive dicing tape from stud pull measurement
YM Cheung, ACM Chong, B Huang
2006 International Conference on Electronic Materials and Packaging, 1-10, 2006
152006
Peeling device for chip detachment
YM Cheung, CM Chong, CH Yiu
US Patent App. 10/857,067, 2005
152005
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