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Yiu Ming Cheung
Yiu Ming Cheung
Freelance Consultant, Ph.D, SMIEEE
Verified email at ieee.org - Homepage
Title
Cited by
Cited by
Year
Warpage and thermal characterization of fan-out wafer-level packaging
JH Lau, M Li, D Tian, N Fan, E Kuah, W Kai, M Li, J Hao, YM Cheung, Z Li, ...
IEEE transactions on components, packaging and manufacturing technology 7 ¡K, 2017
1392017
Design, materials, process, fabrication, and reliability of fan-out wafer-level packaging
JH Lau, M Li, QM Li, I Xu, T Chen, Z Li, KH Tan, QX Yong, Z Cheng, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (6 ¡K, 2018
842018
Fan-out wafer-level packaging for heterogeneous integration
JH Lau, M Li, ML Qingqian, T Chen, I Xu, QX Yong, Z Cheng, N Fan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 ¡K, 2018
812018
Optical nonlinearities of tea studied by Z-scan and four-wave mixing techniques
YM Cheung, SK Gayen
JOSA B 11 (4), 636-643, 1994
741994
Excited-state absorption in Pr 3+: Y 3 Al 5 O 12
YM Cheung, SK Gayen
Physical Review B 49 (21), 14827, 1994
711994
Chip-first fan-out panel-level packaging for heterogeneous integration
CT Ko, H Yang, JH Lau, M Li, M Li, C Lin, JW Lin, T Chen, I Xu, CL Chang, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 ¡K, 2018
562018
Two-photon excitation of the lowest 4¡÷4f5d near-ultraviolet transitions in :
SK Gayen, BQ Xie, YM Cheung
Physical review B 45 (1), 20, 1992
521992
Thermal compression bonding of semiconductor chips
YM Cheung, TYP Lo, M Li, YH Mak, K San LAM
US Patent 8,967,452, 2015
482015
Effect of electrode pattern on the outputs of piezosensors for wire bonding process control
SS Chiu, HLW Chan, SW Or, YM Cheung, PCK Liu
Materials Science and Engineering: B 99 (1-3), 121-126, 2003
382003
Vibration-induced die detachment system
YM Cheung, MK Chow
US Patent 7,757,742, 2010
332010
Apparatus for semiconductor chip detachment
YM Cheung, CK Liu, CH Yiu, CM Chong
US Patent 7,240,422, 2007
292007
Pick and place assembly for transporting a film of material
YM Cheung, CM Chong
US Patent 7,182,118, 2007
232007
Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding
YH Chan, JK Kim, D Liu, PCK Liu, YM Cheung, MW Ng
IEEE transactions on advanced packaging 28 (4), 674-684, 2005
232005
Reliability of fan-out wafer-level packaging with large chips and multiple re-distributed layers
J Lau, M Li, L Yang, M Li, QX Yong, Z Cheng, T Chen, I Xu, N Fan, E Kuah, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1574-1582, 2018
222018
Piezoelectric sensor for measuring bonding parameters
LW Chan-Wong, S San Chiu, SW Or, YM Cheung
US Patent 6,279,810, 2001
222001
A high throughput and reliable thermal compression bonding process for advanced interconnections
M Li, DW Tian, YM Cheung, L Yang, JH Lau
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 603-608, 2015
202015
Peeling device for chip detachment
YM Cheung, CM Chong, CH Yiu
US Patent App. 10/857,067, 2005
192005
Finite element stress analysis of thin die detachment process
ACM Chong, YM Cheung
Fifth International Conference onElectronic Packaging Technology Proceedings ¡K, 2003
192003
Simulation of the alignment sensitivity on the coupling efficiency of a ball-lens capped TO-can laser diode source into a single-mode fiber
YM Cheung, CH Yiu
Proceedings of the 4th International Symposium on Electronic Materials and ¡K, 2002
192002
Reliability of fan-out wafer-level heterogeneous integration
J Lau, M Li, Y Lei, M Li, I Xu, T Chen, QX Yong, Z Cheng, W Kai, P Lo, Z Li, ...
International Symposium on Microelectronics 2018 (1), 000224-000232, 2018
182018
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