| Multi-objective optimization of 3D printed liquid cooled heat sink with guide vanes for targeting hotspots in high heat flux electronics AR Gharaibeh, MI Tradat, S Rangarajan, BG Sammakia, HA Alissa International Journal of Heat and Mass Transfer 184, 122287, 2022 | 32 | 2022 |
| Shifting to energy efficient hybrid cooled data centers using novel embedded floor tiles heat exchangers YM Manaserh, MI Tradat, AR Gharaibeh, BG Sammakia, R Tipton Energy Conversion and Management 247, 114762, 2021 | 22 | 2021 |
| Impact of fin geometry and surface roughness on performance of an impingement two-phase cooling heat sink CH Hoang, N Fallahtafti, S Rangarajan, A Gharaibeh, Y Hadad, C Arvin, ... Applied Thermal Engineering 198, 117453, 2021 | 21 | 2021 |
| Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink AR Gharaibeh, YM Manaserh, MI Tradat, FW AlShatnawi, SN Schiffres, ... Journal of Electronic Packaging 144 (3), 031017, 2022 | 11 | 2022 |
| An investigation of multi-parameters effects on the performance of liquid-to-liquid heat exchangers in rack level cooling A Heydari, Q Soud, M Tradat, A Gharaibeh, N Fallahtafti, P Shahi, ... 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 3 | 2023 |
| Guidelines and Experimental Hydraulic performance Evaluation for Single-Phase CDUs Under Steady and Transient Events A Heydari, AR Gharaibeh, M Tradat, Y Manaserh, Q Soud, V Radmard, ... 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 3 | 2023 |
| Experimental and numerical analysis of data center pressure and flow fields induced by backward and forward CRAH technology MI Tradat, YMA Manaserh, A Gharaibeh, BG Sammakia, D Hall, K Nemati, ... Journal of Electronic Packaging 144 (3), 031015, 2022 | 3 | 2022 |
| Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate V Radmard, AR Gharaibeh, MI Tradat, CH Hoang, YY Manaserh, ... Journal of Electronic Packaging 145 (2), 021001, 2023 | 2 | 2023 |
| Experimental evaluation of direct-to-chip cold plate liquid cooling for high-heat-density data centers A Heydari, AR Gharaibeh, M Tradat, Y Manaserh, V Radmard, B Eslami, ... Applied Thermal Engineering 239, 122122, 2024 | 1 | 2024 |
| Spatial Thermal Conductivity Variation of Particulate-Filled Thermal Interface Materials Z Zhang, PA Kulkarni, M Daeumer, A Gharaibeh, JY Chang, B Sammakia, ... 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 1 | 2022 |
| Improving Heat Transfer and Flow Distribution of Pin Fin Heat Sink Using Multi-Inlets/Outlets Manifold AR Gharaibeh State University of New York at Binghamton, 2021 | 1 | 2021 |
| Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks A Heydari, AR Gharaibeh, M Tradat, Q Soud, Y Manaserh, V Radmard, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning A Heydari, Q Soud, M Tradat, A Gharaibeh, N Fallahtafti, J Rodriguez, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module AR Gharaibeh, Q Soud, Y Manaserh, M Tradat, B Sammakia International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| Parameters of Performance: A Deep Dive into L2a Cdu Assessment A Heydari, AR Gharaibeh, M Tradat, Q Soud, Y Manaserh, V Radmard, ... Available at SSRN 4772556, 0 | | |
Bahgat G SammakiaBinghamton UniversityVerified email at binghamton.edu
