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Mehdi AsheghiAdjunct Professor of Mechanical Engineerig, Stanford University在 stanford.edu 的电子邮件经过验证
Thomas KennyProfessor of Mechanical Engineering, Stanford University在 cdr.stanford.edu 的电子邮件经过验证
Eric PopPease-Ye Professor of Electrical Eng., Materials Sci., App. Phys., Stanford & SLAC在 stanford.edu 的电子邮件经过验证
Juan G. SantiagoProfessor, Mechanical Engineering, Stanford University在 stanford.edu 的电子邮件经过验证
H.-S. Philip WongProfessor of Electrical Engineering, Stanford University在 stanford.edu 的电子邮件经过验证
Y. Sungtaek JUUCLA在 g.ucla.edu 的电子邮件经过验证
Aditya SoodAssistant Professor, Princeton University在 stanford.edu 的电子邮件经过验证
Amy MarconnetMechanical Engineering, Purdue University在 purdue.edu 的电子邮件经过验证
Michael T BarakoSenior Staff Scientist, NG Next Basic Research Laboratory, Northrop Grumman Space Systems在 NorthropGrummanNext.net 的电子邮件经过验证
William P. KingRalph A. Andersen Endowed Chair, Department of Mechanical Science and Engineering, University of在 illinois.edu 的电子邮件经过验证
Evelyn N WangMechanical Engineering, MIT在 mit.edu 的电子邮件经过验证
David G. CahillDepartment of Materials Science and Engineering, University of Illinois at Urbana-Champaign在 illinois.edu 的电子邮件经过验证
James PalkoAssociate Professor, University of California, Merced在 ucmerced.edu 的电子邮件经过验证
Jungwan ChoAssociate Professor, Sungkyunkwan University在 skku.edu 的电子邮件经过验证
Simon PhillpotDistinguished Professor of Materials Science & Engineering, University of Florida在 mse.ufl.edu 的电子邮件经过验证
Sanjiv SinhaAsst. Professor of Mechanical Engineering, University of Illinois在 illinois.edu 的电子邮件经过验证
Woosung ParkMechanical Engineering, Sogang University在 sogang.ac.kr 的电子邮件经过验证
Hongjie DaiProfessor of chemistry, stanford university在 stanford.edu 的电子邮件经过验证
Sangbum KimMaterials Science and Engineering, Seoul National University在 snu.ac.kr 的电子邮件经过验证
Ki Wook JungSamsung Electronics在 alumni.stanford.edu 的电子邮件经过验证