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Haeleen Hong
Haeleen Hong
Verified email at ncsu.edu
Title
Cited by
Cited by
Year
Anisotropic thermal conductive composite by the guided assembly of boron nitride nanosheets for flexible and stretchable electronics
H Hong, YH Jung, JS Lee, C Jeong, JU Kim, S Lee, H Ryu, H Kim, Z Ma, ...
Advanced Functional Materials 29 (37), 1902575, 2019
1662019
A liquid metal mediated metallic coating for antimicrobial and antiviral fabrics
KY Kwon, S Cheeseman, A Frias‐De‐Diego, H Hong, J Yang, W Jung, ...
Advanced Materials 33 (45), 2104298, 2021
1122021
Effective assembly of nano-ceramic materials for high and anisotropic thermal conductivity in a polymer composite
H Hong, JU Kim, T Kim
Polymers 9 (9), 413, 2017
812017
A semi-permanent and durable nanoscale-crack-based sensor by on-demand healing
B Park, S Lee, H Choi, JU Kim, H Hong, C Jeong, D Kang, T Kim
Nanoscale 10 (9), 4354-4360, 2018
582018
Omnidirectional, Broadband Light Absorption in a Hierarchical Nanoturf Membrane for an Advanced Solar‐Vapor Generator
JU Kim, SJ Kang, S Lee, J Ok, Y Kim, SH Roh, H Hong, JK Kim, H Chae, ...
Advanced Functional Materials 30 (50), 2003862, 2020
512020
On-demand drug release from gold nanoturf for a thermo-and chemotherapeutic esophageal stent
S Lee, G Hwang, TH Kim, SJ Kwon, JU Kim, K Koh, B Park, H Hong, ...
ACS nano 12 (7), 6756-6766, 2018
372018
Avoiding heating interference and guided thermal conduction in stretchable devices using thermal conductive composite islands
SJ Kang, H Hong, C Jeong, JS Lee, H Ryu, J Yang, JU Kim, YJ Shin, ...
Nano Research 14, 3253-3259, 2021
262021
Solvent-assisted filling of liquid metal and its selective dewetting for the multilayered 3D interconnect in stretchable electronics
W Jung, GR Koirala, JS Lee, JU Kim, B Park, YJ Jo, C Jeong, H Hong, ...
ACS nano 16 (12), 21471-21481, 2022
92022
Non-yellowish and heat-resistant adhesive for a transparent heat sinking film
H Ryu, H Choi, J hwan Shin, H Hong, B Park, EG Lee, T Kim
Journal of Industrial and Engineering Chemistry 103, 275-282, 2021
22021
Solvent-Assisted Filling of Liquid Metal and Its Selective Dewetting for the Multilayered 3D Interconnect in Stretchable Electronics (vol 16, 21471, 2022)
W Jung, GR Koirala, JS Lee, JU Kim, B Park, YJ Jo, C Jeong, H Hong, ...
ACS NANO, 2023
2023
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