| Volume ratios between the thermophilic and the mesophilic digesters of a temperature-phased anaerobic digestion system affect their performance and microbial communities W Lv, W Zhang, Z Yu New biotechnology 33 (1), 245-254, 2016 | 17 | 2016 |
| Rapid thermal cycling by eddy current inducted heating on optical property and thermostability of high power LED J Chen, W Guo, Y Liu, W Zhang, B An, Y Wu 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 8 | 2012 |
| 用纳米铜油墨印刷 RFID 标签天线 孙亮权， 安兵， 李健， 张文斐 电子工艺技术, 6-9, 2013 | 4 | 2013 |
| Research on thermal shock test for the optical and electrical properties of white LEDs Y Liu, J Chen, W Guo, W Zhang, Y Wu, B An 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 4 | 2012 |
| 纳米材料互连技术研究进展 张金鹏， 安兵， 王强翔， 张文斐， 吴懿平 电子工艺技术 33 (4), 189-192, 2012 | 3 | 2012 |
| High ionic conductivity of ultra-low yttria concentration yttria-stabilized zirconia thin films W Zhang, B Hua, M Miao, K Cadien, JL Luo JVST: A 40 (4), 40, 042405, 2022 | 2 | 2022 |
| An improved mean filter algorithm based on gray-scale difference and its application in X-ray detection system P Wang, W Lv, W Zhang, B An, Y Wu 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 2 | 2012 |
| System Performance and Microbial Communities of Anaerobic Digestion Systems Fed Dairy Manure W Lv, W Zhang, Z Yu Environmental Engineering Science 33 (12), 986-995, 2016 | 1 | 2016 |
| Research on shear creep properties of SAC305 solder bumps in ball grid array W Zhang, B An, W Guo, S Chai, Y Wu 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 1 | 2012 |
| Shear creep behavior of Sn-3Ag-0.5 Cu solder bumps in ball grid array B An, G Gu, W Zhang, Y Wu 2011 International Symposium on Advanced Packaging Materials (APM), 257-261, 2011 | 1 | 2011 |
| Microstructural evolution of Sn single grain microbumps for 3D-TSV high density solder interconnection under thermal aging tests X Shen, B Wang, W Zhang, B An, Y Wu 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | | 2012 |
| SAC305 球栅阵列无铅焊点蠕变研究 张文斐 华中科技大学, 2012 | | 2012 |
| 无铅焊料的蠕变行为研究进展 张文斐， 安兵， 柴駪， 吕卫文， 吴懿平 电子工艺技术 33 (4), 193-198, 2012 | | 2012 |
