3.2-mW ultra-low-power 173–207-GHz amplifier with 130-nm SiGe HBTs operating in saturation Y Zhang, W Liang, X Jin, M Krattenmacher, S Falk, P Sakalas, ... IEEE Journal of Solid-State Circuits 55 (6), 1471-1481, 2020 | 30 | 2020 |
Advanced SiGe:C HBTs at cryogenic temperatures and their compact modeling with temperature scaling X Jin, M Müller, P Sakalas, A Mukherjee, Y Zhang, M Schröter IEEE Journal on Exploratory Solid-State Computational Devices and Circuits 7 (2), 2021 | 16 | 2021 |
12-mW 97-GHz low-power downconversion mixer with 0.7-V supply voltage Y Zhang, W Liang, P Sakalas, A Mukherjee, X Jin, J Krause, M Schröter IEEE Microwave and Wireless Components Letters 29 (4), 279-281, 2019 | 12 | 2019 |
Methods for Extracting the Temperature-and Power-Dependent Thermal Resistance for SiGe and III-V HBTs From DC Measurements: A Review and Comparison Across Technologies MS Markus Müller , Vincenzo d’Alessandro , Sophia Falk, Christoph Weimer ... IEEE Transactions on Electron Devices, 2022 | 8 | 2022 |
A physics-based analytical formulation for the tunneling current through the base of bipolar transistors operating at cryogenic temperatures M Schröter, X Jin IEEE transactions on electron devices 70 (1), 247-253, 2022 | 7 | 2022 |
Compact modeling of SiGe HBTs for design of cryogenic control and readout circuits for quantum computing H Ying, SG Rao, JW Teng, M Frounchi, M Müller, X Jin, M Schröter, ... 2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and …, 2020 | 7 | 2020 |
Characterization of dynamic large-signal operating limits and long-term RF reliability of SiGe HBTs C Weimer, X Jin, GG Fischer, M Schröter 2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and …, 2022 | 6 | 2022 |
LO Chain (× 12) Integrated 190-GHz Low-Power SiGe Receiver With 49-dB Conversion Gain and 171-mW DC Power Consumption Y Zhang, W Liang, C Esposito, X Jin, P Sakalas, M Schröter IEEE Transactions on Microwave Theory and Techniques 69 (3), 1943-1954, 2021 | 6 | 2021 |
66 GHz 11.5 mW low-power SiGe frequency quadrupler operating at 300 K and 4 K Y Zhang, X Jin, W Liang, P Sakalas, M Schröter 2022 14th German Microwave Conference (GeMiC), 100-103, 2022 | 4 | 2022 |
X- and Ku-Band SiGe-HBT Voltage-Controlled Ring Oscillators for Cryogenic Applications E Vardarli, A Mukherjee, X Jin, P Sakalas, M Schröter IEEE Journal on Exploratory Solid-State Computational Devices and Circuits 7 (2), 2021 | 4 | 2021 |
Thermal impedance of SiGe HBTs: Characterization and modeling X Jin, G Liang, Y Zimmermann, G Fischer, C Weimer, M Krattenmacher, ... 2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and …, 2022 | 3 | 2022 |
Modeling the temperature dependence of sheet and contact resistances in SiGe: C HBTs from 4.3 to 423 K X Jin, C Weimer, Y Zhang, M Schröter 2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and …, 2020 | 3 | 2020 |
Characterization and compact modeling of the thermal resistance of SiGe HBTs from cryogenic to room temperature X Jin, G Liang, M Müller, M Schröter IEEE Transactions on Electron Devices, 2023 | 1 | 2023 |
A Q-band SiGe-HBT cryogenic colpitts VCO for frequency-division multiplexed quantum computing E Vardarli, X Jin, AYK Chen, K Aufinger, M Schröter 2023 IEEE/MTT-S International Microwave Symposium-IMS 2023, 549-552, 2023 | 1 | 2023 |
A Cryogenic 561 W Ultralow-Power 56–62 GHz Low Noise Amplifier in 130-nm SiGe HBTs B Peng, X Jin, K Aufinger, M Schröter IEEE Microwave and Wireless Technology Letters, 2023 | | 2023 |
Modeling and Parameter Extraction of SiGe HBTs at Cryo-genic Temperatures using Open-Source Tools DMT and VerilogAE X Jin, M Müller, M Krattenmacher, P Kuthe, C Weimer, M Schröter | | 2022 |
Characterization and modeling of thermal impedance for advanced SiGe HBT X Jin, G Liang, M Schröter 33rd workshop AKB, 2021 | | 2021 |
Temperature dependent modeling of sub-mm-wave SiGe HBT X Jin, N Weddeler, M Schröter HICUM Workshop 2018, 2018 | | 2018 |
Contributions to TCAD and compact modeling of SiGe HBTs at room and cryogenic temperatures X Jin Chair for Electron Devices and Integrated Circuits, Dresden University of …, 2018 | | 2018 |