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Ricky FuPlasma Technology Limited / City University of Hong KongVerified email at cityu.edu.hk
Kaifu HUOHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Kelvin YeungDepartment of Orthopaedics and Traumatology, The University of Hong KongVerified email at hku.hk
Xuefeng Yu (喻学锋)Professor of Shenzhen Institutes of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
Xuanyong LiuProfessor of Shanghai Institute of Ceramics, Chinese Academy of SciencesVerified email at mail.sic.ac.cn
Shuilin WUTianjin UniversityVerified email at tju.edu.cn
Huaiyu WangShenzhen Institutes of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
Xiang Peng (彭祥)Wuhan Institute of TechnologyVerified email at wit.edu.cn
Penghui LiShenzhen Institute of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
Guosong WuProfessor, Hohai University, Nanjing, ChinaVerified email at hhu.edu.cn
Kenneth M C CheungChair Professor, Department of Orthopaedics and Traumatology, University of Hong KongVerified email at hku.hk
Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongVerified email at cityu.edu.hk
Hao Huang (黄浩)Shenzhen Institute of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
Tao HuApplied Materials Inc.Verified email at amat.com
Xuming Zhangwuhan university of science and technologyVerified email at wust.edu.cn
Liuhe LiBeihang UniversityVerified email at buaa.edu.cn
Yongfeng MeiFudan UniversityVerified email at fudan.edu.cn
Yunchang xin重庆大学Verified email at cqu.edu.cn
Hanhan XieSouthern University of Science and TechnologyVerified email at sustech.edu.cn
zhengwei wuustcVerified email at ustc.edu.cn
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Paul K Chu
Chair Professor of Materials Engineering, City University of Hong Kong
Verified email at cityu.edu.hk - Homepage