Bo Wang
Bo Wang
College of Science and Engineering, Hamad Bin Khalifa University
Verified email at hbku.edu.qa - Homepage
Title
Cited by
Cited by
Year
A Passive RFID Tag Embedded Temperature Sensor With Improved Process Spreads Immunity for a to 60 Sensing Range
B Wang, MK Law, A Bermak, HC Luong
IEEE Transactions on Circuits and Systems I: Regular Papers 61 (2), 337-346, 2014
492014
Low-power CMOS image sensor based on column-parallel single-slope/SAR quantization scheme
F Tang, DG Chen, B Wang, A Bermak
IEEE transactions on electron devices 60 (8), 2561-2566, 2013
412013
A Column-Parallel Inverter-Based Cyclic ADC for CMOS Image Sensor With Capacitance and Clock Scaling
F Tang, B Wang, A Bermak, X Zhou, S Hu, X He
IEEE Transactions on Electron Devices 63 (1), 162 - 167, 2016
182016
A Precision CMOS Voltage Reference Exploiting Silicon Bandgap Narrowing Effect
B Wang, MK Law, A Bermak
IEEE Transactions on Electron Devices 62 (7), 2128 - 2135, 2015
172015
A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design
W Xu, B Gao, M Ahmed, M Duan, B Wang, S Mohamad, A Bermak, ...
2017 IEEE 30th Intl' Conf. MEMS, 989-992, 2017
132017
80dB dynamic range 100KHz bandwidth inverter-based ΣΔ ADC for CMOS image sensor
F Tang, B Wang, A Bermak
2012 IEEE International Symposium on Circuits and Systems (ISCAS), 3094-3097, 2012
112012
CMOS on-chip stable true-random ID generation using antenna effect
F Tang, DG Chen, B Wang, A Bermak, A Amira, S Mohamad
IEEE electron device letters 35 (1), 54-56, 2013
82013
A 10.6 pJˇ K 2 Resolution FoM Temperature Sensor Using Astable Multivibrator
B Wang, MK Law, CY Tsui, A Bermak
IEEE Transactions on Circuits and Systems II: Express Briefs 65 (7), 869-873, 2018
52018
A three-dimensional integrated micro calorimetric flow sensor in CMOS MEMS technology
W Xu, B Wang, M Duan, M Ahmed, A Bermak, YK Lee
IEEE Sensors Letters 3 (2), 1-4, 2019
42019
A −12.3 dBm UHF Passive RFID Sense Tag for Grid Thermal Monitoring
B Wang, MK Law, J Yi, CY Tsui, A Bermak
IEEE Transactions on Industrial Electronics 66 (11), 8811-8820, 2019
42019
A low power class-AB audio power amplifier with dynamic transconductance compensation in 55 nm CMOS process
F Tang, S Li, B Wang, A Bermak, X Zhou, S Hu
IEEE Transactions on Circuits and Systems I: Regular Papers 63 (9), 1360-1369, 2016
42016
BJT Process Spread Compensation Utilizing Base Recombination Current in Standard CMOS
B Wang, MK Law, A Bermak, F Tang
IEEE Electron Device Letters 36 (11), 1111 - 1113, 2015
42015
A low-cost capacitive relative humidity sensor for food moisture monitoring application
B Wang, MK Law, A Bermak
2012 4th Asia Symposium on Quality Electronic Design (ASQED), 95-99, 2012
42012
A sub-1V BJT-based CMOS temperature sensor from− 55° C to 125° C
B Wang, MK Law, F Tang, A Bermak
2012 IEEE International Symposium on Circuits and Systems (ISCAS), 3114-3117, 2012
42012
Wide dynamic range PSD algorithms and their implementation for compressive imaging
B Zhang, X Zhong, B Wang, PV Sander, A Bermak
2016 IEEE International Symposium on Circuits and Systems (ISCAS), 2727-2730, 2016
32016
A 2.2uW 15b incremental delta-sigma ADC with output-driven input segmentation
B Wang, MK Law, S Mohamad, A Bermak
2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 7-8, 2016
32016
Piecewise BJT process spread compensation exploiting base recombination current
D Sun, MK Law, B Wang, PI Mak, RP Martins
2017 IEEE International Symposium on Circuits and Systems (ISCAS), 1-4, 2017
22017
A reconfigurable time-domain comparator for multi-sensing applications
X Zhong, B Wang, A Bermak
2015 IEEE International Symposium on Circuits and Systems (ISCAS), 349-352, 2015
22015
An Inkjet-printed Strain Sensor with a Carbon-SilverPolyimide Topology
Y Yi, S Ali, B Wang
2019 IEEE International Conference on Flexible and Printable Sensors and …, 2019
12019
A Low-Cost Strain Gauge Displacement Sensor Fabricated via Shadow Mask Printing
Y Yi, B Wang, A Bermak
Sensors 19 (21), 4713, 2019
12019
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Articles 1–20