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Amine Bermak, IEEE FellowProfessor, College of Science and Engineering, Hamad Bin Khalifa University,Verified email at hbku.edu.qa
Man-Kay LawUniversity of MacauVerified email at umac.mo
Saleem Khan, PhDR&D Engineer, CSEM SAVerified email at csem.ch
Wei XuShenzhen UniversityVerified email at szu.edu.cn
Denis Guangyin ChenApple Inc.Verified email at apple.com
Chi Ying TsuiHong Kong University of Science and TechnologyVerified email at ece.ust.hk
Howard Cam Luong, IEEE FellowProfessor, ECE, HKUSTVerified email at ust.hk
Mu ChiaoDepartment of Mechanical Engineering, The University of British ColumbiaVerified email at mech.ubc.ca
Xiaopeng ZhongQualcommVerified email at mit.edu
Zizhen ZengAnalog IC Design Engineer, Texas InstrumentsVerified email at tamu.edu
Rui MartinsIEEE Fellow, Chair Professor (ECE), Director of IME, University of MacauVerified email at umac.mo
Pui-In Mak (Elvis)Professor, Fellow of IEEE, IET and RSC, CAS Overseas Expert, University of MacauVerified email at umac.mo
Tantan ZhangA*STAR-Institute of MicroelectronicsVerified email at ime.a-star.edu.sg
Fang TANGChongqing University, Chongqing, China