| A digitally controlled fully integrated voltage regulator with on-die solenoid inductor with planar magnetic core in 14-nm tri-gate CMOS HK Krishnamurthy, V Vaidya, P Kumar, R Jain, S Weng, ST Kim, ... IEEE Journal of Solid-State Circuits 53 (1), 8-19, 2017 | 93 | 2017 |
| Adaptive rectifier and method of operation G Lisi, NV Desai, S Arora, R Subramonian, G Socci, D Du US Patent 9,831,684, 2017 | 44 | 2017 |
| A digitally controlled fully integrated voltage regulator with 3-D-TSV-based on-die solenoid inductor with a planar magnetic core for 3-D-stacked die applications in 14-nm tri … HK Krishnamurthy, S Weng, GE Mathew, N Desai, R Saraswat, ... IEEE journal of solid-state circuits 53 (4), 1038-1048, 2017 | 36 | 2017 |
| A bipolarą40 mV self-starting boost converter with transformer reuse for thermoelectric energy harvesting NV Desai, Y Ramadass, AP Chandrakasan Proceedings of the 2014 international symposium on Low power electronics and …, 2014 | 30 | 2014 |
| A fuzzy logic based approach to de-weather fog-degraded images N Desai, A Chatterjee, S Mishra, D Chudasama, S Choudhary, SK Barai 2009 Sixth International Conference on Computer Graphics, Imaging and …, 2009 | 28 | 2009 |
| A Scalable, 2.9 mW, 1 Mb/s e-Textiles Body Area Network Transceiver With Remotely-Powered Nodes and Bi-Directional Data Communication N Desai, J Yoo, AP Chandrakasan Solid-State Circuits, IEEE Journal of 49 (9), 1995-2004, 2014 | 25 | 2014 |
| 8.5 a fully integrated voltage regulator in 14nm CMOS with package-embedded air-core inductor featuring self-trimmed, digitally controlled variable on-time discontinuous … C Schaef, N Desai, H Krishnamurthy, S Weng, H Do, W Lambert, ... 2019 IEEE international solid-state circuits conference-(ISSCC), 154-156, 2019 | 24 | 2019 |
| An actively detuned wireless power receiver with public key cryptographic authentication and dynamic power allocation N Desai, C Juvekar, S Chandak, AP Chandrakasan IEEE Journal of Solid-State Circuits 53 (1), 236-246, 2017 | 24 | 2017 |
| A light-load efficient fully integrated voltage regulator in 14-nm CMOS with 2.5-nH package-embedded air-core inductors C Schaef, N Desai, HK Krishnamurthy, X Liu, KZ Ahmed, S Kim, S Weng, ... IEEE Journal of Solid-State Circuits 54 (12), 3316-3325, 2019 | 21 | 2019 |
| Advanced scaling of enhancement mode high-K gallium nitride-on-300mm-Si (111) transistor and 3D layer transfer GaN-silicon finfet CMOS integration HW Then, M Radosavljevic, P Koirala, N Thomas, N Nair, I Ban, ... 2021 IEEE International Electron Devices Meeting (IEDM), 11.1. 1-11.1. 4, 2021 | 20 | 2021 |
| A low-power integrated power converter for an electromagnetic vibration energy harvester with 150 mV-AC cold startup, frequency tuning, and 50 Hz AC-to-DC conversion U Radhakrishna, P Riehl, N Desai, P Nadeau, Y Yang, A Shin, JH Lang, ... 2018 IEEE Custom Integrated Circuits Conference (CICC), 1-4, 2018 | 14 | 2018 |
| Multiple output voltage conversion V De, K Ravichandran, H Krishnamurthy, K Ahmed, S Vangal, V Vaidya, ... US Patent 11,411,491, 2022 | 12 | 2022 |
| A 32-a, 5-v-input, 94.2% peak efficiency high-frequency power converter module featuring package-integrated low-voltage gan nmos power transistors N Desai, HW Then, J Yu, HK Krishnamurthy, WJ Lambert, N Butzen, ... IEEE Journal of Solid-State Circuits 57 (4), 1090-1099, 2022 | 12 | 2022 |
| Beyond crypto: Physical-layer security for Internet of Things devices RT Yazicigil, PM Nadeau, DD Richman, C Juvekar, S Maji, U Banerjee, ... IEEE Solid-State Circuits Magazine 12 (4), 66-78, 2020 | 12 | 2020 |
| Efficiency maximization for device-to-device wireless charging NV Desai, AP Chandrakasan US Patent 10,498,160, 2019 | 12 | 2019 |
| Advances in Research on 300mm gallium nitride-on-Si (111) NMOS transistor and silicon CMOS integration HW Then, M Radosavljevic, N Desai, R Ehlert, V Hadagali, K Jun, ... 2020 IEEE International Electron Devices Meeting (IEDM), 27.3. 1-27.3. 4, 2020 | 11 | 2020 |
| A 25 mV-startup cold start system with on-chip magnetics for thermal energy harvesting P Garcha, D El-Damak, N Desai, J Troncoso, E Mazotti, J Mullenix, ... ESSCIRC 2017-43rd IEEE European Solid State Circuits Conference, 127-130, 2017 | 9 | 2017 |
| Scaled Submicron Field-Plated Enhancement Mode High-K Gallium Nitride Transistors on 300mm Si (111) Wafer with Power FoM (R ON xQ GG) of 3.1 mohm-nC at 40V and f T/f MAX of 130 … HW Then, M Radosavljevic, P Koirala, M Beumer, S Bader, A Zubair, ... 2022 International Electron Devices Meeting (IEDM), 35.1. 1-35.1. 4, 2022 | 7 | 2022 |
| A ZVS resonant receiver with maximum efficiency tracking for device-to-device wireless charging N Desai, AP Chandrakasan ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference, 313-316, 2016 | 7 | 2016 |
| A scalable 2.9 mW 1Mb/s eTextiles body area network transceiver with remotely powered sensors and bi-directional data communication NV Desai, J Yoo, AP Chandrakasan 2013 IEEE International Solid-State Circuits Conference Digest of Technical …, 2013 | 7 | 2013 |
Vivek DeIntel Fellow, Intel CorporationVerified email at intel.com
