| Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning S Sahir, NP Yerriboina, SY Han, KM Han, TG Kim, N Mahadev, JG Park Applied Surface Science 545, 149035, 2021 | 33 | 2021 |
| Contamination mechanism of ceria particles on the oxide surface after the CMP process KM Han, SY Han, S Sahir, NP Yerriboina, TG Kim, N Mahadev, JG Park ECS Journal of Solid State Science and Technology 9 (12), 124004, 2020 | 27 | 2020 |
| The adhesion and removal mechanism of ceria particles for STI post-CMP cleaning process NP Yerriboina, S Sahir, SY Han, KM Han, JG Park ECS Transactions 92 (2), 157, 2019 | 20 | 2019 |
| Tungsten passivation layer (WO3) formation mechanisms during chemical mechanical planarization in the presence of oxidizers MK Poddar, P Jalalzai, S Sahir, NP Yerriboina, TG Kim, JG Park Applied Surface Science 537, 147862, 2021 | 19 | 2021 |
| Mechanisms of colloidal ceria contamination and cleaning during oxide post CMP cleaning S Sahir, NP Yerriboina, SY Han, TG Kim, N Mahadev, JG Park Microelectronic Engineering 241, 111544, 2021 | 12 | 2021 |
| Effect of slurry particles on PVA brush contamination during post-CMP cleaning S Sahir, HW Cho, P Jalalzai, S Samanta, S Hamada, TG Kim, JG Park Materials Science in Semiconductor Processing 151, 107043, 2022 | 3 | 2022 |
| Effect of Slurry Additives on Co-BTA Complex Stability and Inhibition Property During Co CMP Process P Jalalzai, HY Ryu, S Sahir, RP Meethal, S Hamada, TG Kim, JG Park ECS Journal of Solid State Science and Technology 11 (8), 084006, 2022 | 3 | 2022 |
| Study on PVA brush loading and conditioning during shallow trench isolation post-CMP cleaning process S Sahir, HW Cho, TG Kim, S Hamada, NP Yerriboina, JG Park ECS Journal of Solid State Science and Technology 11 (2), 024004, 2022 | 3 | 2022 |
| Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process SHJGP Samrina Sahir, Hwi-Won Cho, Nagendra Prasad Yerriboina, Tae-Gon Kim Solid State Phenomena 314 (1662-9779), 259-263, 2021 | 2 | 2021 |
| Effect of Skin Layer on Brush Loading, Cross-Contamination, and Cleaning Performance during Post-CMP Cleaning S Sahir, HW Cho, P Jalalzai, J Peter, R Singh, S Hamada, TG Kim, ... ECS Journal of Solid State Science and Technology 11 (5), 054003, 2022 | | 2022 |
| Interaction of ceria particles with oxide and PVA brush during CMP process JG Park, S Sahir 한양대학교, 2022 | | 2022 |
| Mechanism of metal ions adsorption on PVA brush during post-CMP cleaning J Peter, S Bisht, M Yadav, S Sahir, YJ Kim, S Hamada, JG Park | | |
| Effect of colloidal silica and copper ions on PVA brush contamination during post-Cu CMP cleaning S Bisht, J Peter, S Sahir, S Hamada, YJ Kim, TG Kim, JG Park | | |
