| Shear and fatigue properties of lead-free solder joints: Modeling and microstructure analysis X Wei, MEA Belhadi, S Hamasha, A Alahmer, R Zhao, B Prorok, ... Journal of Electronic Packaging 145 (2), 021007, 2023 | 20 | 2023 |
| The effect of micro-alloying and surface finishes on the thermal cycling reliability of doped SAC solder alloys FJ Akkara, S Hamasha, A Alahmer, J Evans, MEA Belhadi, X Wei Materials 15 (19), 6759, 2022 | 20 | 2022 |
| Micro indentation measurements of the creep properties of CABGA doped solder joint MEA Belhadi, FJ Akkara, MA Hoque, PP Vyas, X Wei, A Shmatok, ... 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 17 | 2021 |
| Effect of surface finish on the fatigue behavior of Bi-based solder joints S Su, M Jian, X Wei, FJ Akkara, J Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 14 | 2019 |
| Shear fatigue analysis of SAC-Bi solder joint exposed to varying stress cycling conditions M Jian, A Alahmer, X Wei, MEA Belhadi, A Alakayleh, S Tahat IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 11 | 2023 |
| Analysis and modeling of aged SAC-Bi solder joints subjected to varying stress cycling conditions M Jian, S Hamasha, A Alahmer, M Hamasha, X Wei, MEA Belhadi, ... Materials 16 (2), 750, 2023 | 11 | 2023 |
| Assessing the SAC305 solder joint fatigue in ball grid array assembly using strain-controlled and stress-controlled approaches X Wei, S Hamasha, A Alahmer, MEA Belhadi Journal of Electronic Packaging 145 (3), 031005, 2023 | 10 | 2023 |
| Fatigue performance of doped SAC solder joints in BGA assembly X Wei, S Su, H Ali, J Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 9 | 2020 |
| Effect of temperature on the low cycle fatigue properties of BGA solder joints X Wei, A Alahmer, H Ali, S Tahat, PP Vyas Microelectronics Reliability 146, 115031, 2023 | 8 | 2023 |
| Drop shock performance of SAC-Bi compared to SnPb PP Vyas, MEA Belhadi, X Wei, E Hamasha, A Alakayleh, A Srinivasan, ... 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 8 | 2022 |
| Fatigue performance of ball grid array components at elevated temperature X Wei, M Jian, MEA Belhadi, J Suhling, P Lall 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 8 | 2021 |
| Fatigue performance of aged SAC-Bi solder joint under varying stress cycling M Jian, PP Vyas, X Wei, MEA Belhadi, J Suhling, P Lall 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 6 | 2021 |
| Reliability of new SAC-Bi solder alloys in thermal cycling with aging FJ Akkara, M Abueed, M Belhadi, X Wei, S Hamasha, H Ali, J Suhling, ... Proceedings of IPC APEX, 1-8, 2020 | 6 | 2020 |
| Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling MEA Belhadi, X Wei, P Vyas, R Zhao, S Hamasha, H Ali, J Suhling, P Lall, ... | 5 | 2022 |
| Power Law Creep Behavior Model Of 3rd Generation Lead-Free Alloys Considering Isothermal Aging M Belhadi, S Hamasha, A Alahmer, X Wei, A Alakayleh Journal of Electronic Packaging, 1-34, 2024 | 3 | 2024 |
| Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature X Wei, A Alahmer, MEA Belhadi, PP Vyas Microelectronics Reliability 149, 115217, 2023 | 3 | 2023 |
| Fatigue and shear properties of novel lead-free solder joints with low melting temperatures X Wei, MEA Belhadi, PP Vyas, ARN Sakib, H Ali 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 3 | 2022 |
| Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue M Jian, X Wei, J Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 3 | 2020 |
| Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling MEA Belhadi, X Wei, Q Qasaimeh, P Vyas, R Zhao, E Hmasha, D Ali, ... 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 1 | 2022 |
| COMBINED CREEP AND FATIGUE LOADINGS ON SAC305 SOLDER JOINT M Abueed, M Belhadi, X Wei, S Hamasha | 1 | 2020 |
Mohamed El Amine BELHADI, Ph.D.Postdoctoral Researcher at Auburn UniversityVerified email at auburn.edu
