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Jiawei Zhang
Jiawei Zhang
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Title
Cited by
Cited by
Year
Encapsulation technologies for electronic applications
H Ardebili, J Zhang, MG Pecht
William Andrew, 2018
2492018
Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 3 …, 2013
1322013
Improved predictions of lead free solder joint reliability that include aging effects
M Motalab, Z Cai, JC Suhling, J Zhang, JL Evans, MJ Bozack, P Lall
2012 IEEE 62nd Electronic Components and Technology Conference, 513-531, 2012
1312012
Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder Joints
JCS Jiawei Zhang, Zhou Hai, Sivasubramanian
Orlando, F. L. "Journal of Surface Mount Technology." (2012). 25 (3), 19-28, 2012
130*2012
Correlation of reliability models including aging effects with thermal cycling reliability data
M Motalab, M Mustafa, JC Suhling, J Zhang, J Evans, MJ Bozack, P Lall
2013 IEEE 63rd Electronic Components and Technology Conference, 986-1004, 2013
1212013
LONG-TERM AGING EFFECTS ON THE RELIABILITY OF LEAD FREE SOLDER JOINTS IN BALL GRID ARRAY PACKAGES WITH VARIOUS PITCH SIZES AND BALL ALIGNMENTS
JLE Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, MJ Bozack
Journal of Surface Mount Technology 29 (2), 37-46, 2016
67*2016
Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes
CS John Evans Zhou (Joe) Hai, Jiawei Zhang
Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015
65*2015
Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints
J Zhang, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek
Components, Packaging and Manufacturing Technology, IEEE Transactions on 2 …, 2012
462012
Reliability Degradation of SAC105 and SAC305 BGA Packages Under Long-Term, High Temperature Aging
JLE Zhou Hai, Jiawei Zhang, Chaobo Shen, E. K. Snipes, J. C. Suhling, M. J ...
Orlando, F. L. "Journal of Surface Mount Technology." (2014). 27 (2), 11-18, 2014
41*2014
Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cycling
C Shen, Z Hai, C Zhao, J Zhang, JL Evans, MJ Bozack, JC Suhling
Materials 10 (5), 451, 2017
282017
Long-term Aging Effects on Reliability Performance of Lead-Free Solder Joints
M. J. Bozack, and Richard Sesek Zhou Hai, Jiawei
SMTA International Conference Proceedings 2013, 362-370, 2013
15*2013
The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys
N Vijayakumar, S Thirugnanasambandam, P Soobramaney, J Zhang, ...
2013 IEEE International Symposium on Advanced Packaging Materials, 69-81, 2013
142013
Tin-bismuth plating for component finishes
R Zhang, J Zhang, J Evans, W Johnson, J Vardaman, I Fujimura, A Tseng, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2060-2066, 2011
132011
Component level reliability on different dimensions of lead free wafer level chip scale packages subjected to extreme temperatures
S Thirugnanasambandam, J Zhang, J Evans, F Xie, M Perry, B Lewis, ...
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
122012
AGING EFFECTS ON CREEP BEHAVIORS OF LEAD-FREE SOLDER JOINTS AND RELIABILITY OF FINE-PITCH PACKAGES
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek, ...
SMTA International Conference Proceedings 2012, 2012
112012
DROP RELIABILITY TEST ON DIFFERENT DIMENSIONAL LEAD-FREE WAFER LEVEL CHIP SCALE PACKAGES
S Thirugnanasambandam, N Vijayakumar, J Zhang, J Evans, F Xie, ...
92012
Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling
JCS Chaobo Shen, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack
48th International Symposium on Microelectronics, 2015
62015
Isothermal Aging Effects on the Harsh Environment Performance of Lead-Free Solder
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack
proc. 45th International Symposium on Microelectronics, 000801-000808, 2012
62012
Effects on the Reliability of Lead-Free Solder Joints under Harsh Environment
JE Zhou (Joe) Hai, Jiawei Zhang, Chaobo Shen
47th International Symposium on Microelectronics, 00471-00476, 2014
52014
ISOTHERMAL AGING EFFECTS ON THE HARSH ENVIRONMENT PERFORMANCE OF LEAD-FREE SOLDER JOINTS
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek
SMTA International Conference Proceedings 2012, 2012
52012
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