Influence of Added Phosphorus and Gallium in Lead-free Bismuth-Tin Alloys on Wetting and Intermetallic Compounds I Králová, A Kadlecová, P Veselý, K Dušek 2021 44th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2021 | 7 | 2021 |
Mechanical and Thermal Consequences of Added Phosphorus and Gallium in Lead-free Alloy Based on Bismuth and Tin A Kadlecová, I Králová, P Veselý 2021 44th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2021 | 2 | 2021 |
Solderless Component Assembly: Novel Ecological Approach to Electronics Production P Veselý, J Zdráhal, I Králová, M Klimtová, D Froš 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2023 | 1 | 2023 |
Conductive FDM Filament: Electrical Resistivity Assessment and Sensor Applications D Froš, I Králová 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-7, 2023 | 1 | 2023 |
Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type I Králová, D Pilnaj, O Pop-Georgievski, J Uřičář, P Veselý, M Klimtová, ... Applied Surface Science, 160447, 2024 | | 2024 |
Evaluation of Dendrite Growth between Electrodes with Different Shapes and Voltage Polarity M Klimtová, I Králová 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2023 | | 2023 |
Methodology for Solderability Measurement of Plated Through Holes Using Wetting Balance Test I Králová, M Klimtová, P Veselý 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2023 | | 2023 |
Testování pájitelnosti bezolovnatých slitin metodou smáčecích vah K Iva České vysoké učení technické v Praze. Vypočetní a informační centrum., 2022 | | 2022 |
A Weakness of Wetting Balance Method during the Diagnostic of Connector Pins with Wetting Issue K Dušek, P Veselý, D Froš, M Kozák, K Sorokina, Z Plachý, D Bušek, ... 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2022 | | 2022 |
Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading M Klimtová, I Králová, P Veselý 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2022 | | 2022 |
Impact of Added Gallium and Phosphorus in Bismuth-Tin Solder Alloys on Mechanical Properties and Microstructure of Intermetallic Layer I Králová, M Klimtovà, P Veselý 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-7, 2022 | | 2022 |
Měření pájitelnosti metodou smáčecích vah K Iva České vysoké učení technické v Praze. Vypočetní a informační centrum., 2020 | | 2020 |
Snagcu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux I Králová, P Veselý, D Pilnaj, M Plaček, K Dušek Available at SSRN 4809194, 0 | | |