| Ultrahigh degree of optical polarization above 80% in AlGaN-based deep-ultraviolet LED with moth-eye microstructure S Wang, J Dai, J Hu, S Zhang, L Xu, H Long, J Chen, Q Wan, H Kuo, ... ACS photonics 5 (9), 3534-3540, 2018 | 60 | 2018 |
| High quality 10.6 μm AlN grown on pyramidal patterned sapphire substrate by MOCVD H Long, J Dai, Y Zhang, S Wang, B Tan, S Zhang, L Xu, M Shan, ZC Feng, ... Applied physics letters 114 (4), 2019 | 51 | 2019 |
| High light extraction efficiency of deep ultraviolet LEDs enhanced using nanolens arrays R Liang, J Dai, L Xu, J He, S Wang, Y Peng, H Wang, L Ye, C Chen IEEE transactions on electron devices 65 (6), 2498-2503, 2018 | 46 | 2018 |
| Fabrication of phosphor glass film on aluminum plate by using lead-free tellurite glass for laser-driven white lighting H Wang, Y Mou, Y Peng, Y Zhang, A Wang, L Xu, H Long, M Chen, J Dai, ... Journal of Alloys and Compounds 814, 152321, 2020 | 42 | 2020 |
| Investigation on thermal characterization of eutectic flip-chip UV-LEDs with different bonding voidage R Liang, J Zhang, S Wang, Q Chen, L Xu, J Dai, C Chen IEEE transactions on electron devices 64 (3), 1174-1179, 2017 | 28 | 2017 |
| Degradation in AlGaN-based UV-C LEDs under constant current stress: A study on defect behaviors YZ Wang, XF Zheng, JD Zhu, LL Xu, SR Xu, RL Liang, JN Dai, PX Li, ... Applied Physics Letters 116 (20), 2020 | 27 | 2020 |
| Enhanced wall-plug efficiency in AlGaN-based deep-ultraviolet LED via a novel honeycomb hole-shaped structure S Zhang, F Wu, S Wang, H Zhang, Y Zhang, L Xu, J Dai, C Chen IEEE transactions on electron devices 66 (7), 2997-3002, 2019 | 22 | 2019 |
| Monolithic integration of deep ultraviolet LED with a multiplicative photoelectric converter S Wang, H Long, Y Zhang, Q Chen, J Dai, S Zhang, J Chen, R Liang, L Xu, ... Nano Energy 66, 104181, 2019 | 20 | 2019 |
| Improvement of interface thermal resistance for surface-mounted ultraviolet light-emitting diodes using a graphene oxide silicone composite R Liang, J Dai, L Ye, L Xu, Y Peng, S Wang, J Chen, H Long, C Chen ACS omega 2 (8), 5005-5011, 2017 | 20 | 2017 |
| Optical polarization characteristics and light extraction behavior of deep-ultraviolet LED flip-chip with full-spatial omnidirectional reflector system S Zhang, Y Liu, J Zhang, Y Zhang, L Xu, Q Chen, J Dai, C Chen Optics express 27 (20), A1601-A1614, 2019 | 18 | 2019 |
| Bio-inspired flexible fluoropolymer film for all-mode light extraction enhancement R Liang, R Hu, H Long, X Huang, J Dai, L Xu, L Ye, T Zhai, H Kuo, ... ACS applied materials & interfaces 11 (21), 19623-19630, 2019 | 17 | 2019 |
| Interface anchored effect on improving working stability of deep ultraviolet light-emitting diode using graphene oxide-based fluoropolymer encapsulant R Liang, J Dai, L Xu, Y Zhang, J He, S Wang, J Chen, Y Peng, L Ye, ... ACS applied materials & interfaces 10 (9), 8238-8244, 2018 | 16 | 2018 |
| Phosphor glass-coated sapphire with moth-eye microstructures for ultraviolet-excited white light-emitting diodes H Wang, J Dai, H Sun, Y Mou, Y Cai, R Liang, L Xu, Y Gao, Y Peng, J Li, ... IEEE Transactions on Electron Devices 66 (7), 3007-3011, 2019 | 13 | 2019 |
| Reduction of structural thermal resistance for deep ultraviolet light-emitting diodes fabricated on AlN ceramic substrate via copper-filled thermal holes L Xu, R Liang, J Dai, H Long, S Wang, J Chen, J Xu, X Li, C Chen IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 10 | 2018 |
| High-stability reflective bonding pads for GaN-based flip-chip light-emitting diodes packaged by reflow soldering L Xu, J Xu, W Zhang, R Liang, J Hu, H Long, J Dai, C Chen Journal of Physics D: Applied Physics 52 (26), 265102, 2019 | 3 | 2019 |
| Investigation on thermal characteristics and fabrication of DUV-LEDs using copper filled thermal hole L Xu, R Liang, H Long, J Dai, C Chen 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | 3 | 2017 |
| Evolution of Defect in AlGaN-based Deep Ultraviolet Light Emitting Diodes During Electrical Stress Y Wang, X Zheng, J Zhu, S Xu, X Ma, J Zhang, Y Hao, L Xu, J Dai, P Li 2020 IEEE International Reliability Physics Symposium (IRPS), 1-4, 2020 | 1 | 2020 |
| Fluororesin interfacial agent for LED packaging, and methods for preparing and using same R Liang, XU Linlin, J Chen, S Wang, J Zhang, DU Shida US Patent 10,930,827, 2021 | | 2021 |
| LED package and method for manufacturing the same R Liang, XU Linlin, H Wang, J Chen US Patent 10,636,949, 2020 | | 2020 |
| Thermal investigation of high-power UV-LEDs using graphene oxide silicone encapsulant R Liang, L Xu, Y Peng, J Dai, C Chen 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | | 2017 |
