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Mustafa Mert Torunbalci
Mustafa Mert Torunbalci
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Title
Cited by
Cited by
Year
A bulk-micromachined three-axis capacitive MEMS accelerometer on a single die
S Tez, U Aykutlu, MM Torunbalci, T Akin
Journal of Microelectromechanical Systems 24 (5), 1264-1274, 2015
862015
Quantum error correction below the surface code threshold
R Acharya, L Aghababaie-Beni, I Aleiner, TI Andersen, M Ansmann, ...
arXiv preprint arXiv:2408.13687, 2024
792024
An FBAR circulator
MM Torunbalci, TJ Odelberg, S Sridaran, RC Ruby, SA Bhave
IEEE Microwave and Wireless Components Letters 28 (5), 395-397, 2018
762018
Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding
MM Torunbalci, SE Alper, T Akin
Sensors and Actuators A: Physical 224, 169-176, 2015
682015
Advanced MEMS process for wafer level hermetic encapsulation of MEMS devices using SOI cap wafers with vertical feedthroughs
MM Torunbalci, SE Alper, T Akin
Journal of Microelectromechanical systems 24 (3), 556-564, 2015
452015
Comparison of two alternative silicon-on-glass microfabrication processes for MEMS inertial sensors
MM Torunbalci, E Tatar, SE Alper, T Akin
Procedia Engineering 25, 900-903, 2011
352011
Modular compact modeling of MTJ devices
MM Torunbalci, P Upadhyaya, SA Bhave, KY Camsari
IEEE Transactions on Electron Devices 65 (10), 4628-4634, 2018
322018
Engineering new limits to magnetostriction through metastability in iron-gallium alloys
PB Meisenheimer, RA Steinhardt, SH Sung, LD Williams, S Zhuang, ...
Nature communications 12 (1), 2757, 2021
292021
Double-free-layer magnetic tunnel junctions for probabilistic bits
KY Camsari, MM Torunbalci, WA Borders, H Ohno, S Fukami
Physical Review Applied 15 (4), 044049, 2021
292021
A method and electrical model for the anodic bonding of SOI and glass wafers
E Tatar, MM Torunbalci, SE Alper, T Akin
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems …, 2012
292012
Wafer level hermetic encapsulation of MEMS inertial sensors using SOI cap wafers with vertical feedthroughs
MM Torunbalci, SE Alper, T Akin
2014 International Symposium on Inertial Sensors and Systems (INERTIAL), 1-2, 2014
242014
An all-silicon process platform for wafer-level vacuum packaged MEMS devices
MM Torunbalci, HD Gavcar, F Yesil, SE Alper, T Akin
IEEE Sensors Journal 21 (13), 13958-13964, 2021
182021
Method of wafer-level hermetic packaging with vertical feedthroughs
SE Alper, MM Torunbalci, T Akin
US Patent 9,556,020, 2017
172017
Acceleration insensitive hemispherical shell resonators using pop-up rings
MM Torunbalci, S Dai, A Bhat, SA Bhave
2018 IEEE Micro Electro Mechanical Systems (MEMS), 956-959, 2018
162018
Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs
MM Torunbalci, EC Demir, I Donmez, SE Alper, T Akin
SENSORS, 2014 IEEE, 2187-2190, 2014
152014
Thermalization and Criticality on an Analog-Digital Quantum Simulator
TI Andersen, N Astrakhantsev, A Karamlou, J Berndtsson, J Motruk, ...
arXiv preprint arXiv:2405.17385, 2024
142024
A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process
MM Torunbalci, SE Alper, T Akin
Journal of Micromechanics and Microengineering 25 (12), 125030, 2015
122015
Fabrication and characterization of gold-tin eutectic bonding for hermetic packaging of MEMS devices
EC Demir, MM Torunbalci, I Donmez, YE Kalay, T Akin
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 241-245, 2014
122014
A novel method for fabricating MEMS three-axis accelerometers using low temperature Au-Sn eutectic bonding
S Tez, MM Torunbalci, T Akin
2016 IEEE SENSORS, 1-3, 2016
112016
A method of fabricating vacuum packages with vertical feedthroughs in a wafer level anodic bonding process
MM Torunbalci, SE Alper, T Akin
Procedia Engineering 87, 887-890, 2014
112014
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Articles 1–20