Get my own profile
Public access
View all18 articles
7 articles
available
not available
Based on funding mandates
Co-authors
Vincent LAUChair Professor, HKUSTVerified email at ee.ust.hk
David GesbertProfessor of Electrical Engineering, Dean and Director at EURECOMVerified email at eurecom.fr
Urbashi MitraGordon S. Marshall Chair in Engineering, University of Southern CaliforniaVerified email at usc.edu
An LiuCollege of Information Science and Electronic Engineering, Zhejiang UniversityVerified email at zju.edu.cn
Haifan YinProfessor, Huazhong University of Science & Technology. Previous: HuaweiVerified email at eurecom.fr
Laura CottatellucciFriedrich-Alexander University of Erlangen-NurembergVerified email at fau.de
Moe WinNASA Jet Propulsion Laboratory, AT&T Research Labs, Massachusetts Institute of Technology (MIT)Verified email at mit.edu
Yuan ShenProfessor, EE, Tsinghua UniversityVerified email at tsinghua.edu.cn
Wenhan DaiUMass Amherst and MITVerified email at mit.edu
James SheHKUSTVerified email at ust.hk
Omid EsrafilianResearch Engineer at EURECOMVerified email at eurecom.fr
Fuxin ZhuangMPhil Graduate of Hong Kong University of Science and TechnologyVerified email at alumni.ust.hk
Dr. Yong CHENGResearcher, Bell Labs GermanyVerified email at nt.tu-darmstadt.de
Ning WangOxford UniversityVerified email at maths.ox.ac.uk