| Electric-field-dominated partial discharge in medium voltage SiC power module packaging: model, mechanism, reshaping, and assessment L Wang, Z Zeng, P Sun, S Ai, J Zhang, Y Wang IEEE Transactions on Power Electronics 37 (5), 5422-5432, 2021 | 22 | 2021 |
| Current-bunch concept for parasitic-oriented extraction and optimization of multichip SiC power module L Wang, Z Zeng, P Sun, Y Yu, K Ou, J Wang IEEE Transactions on Power Electronics 36 (8), 8593-8599, 2021 | 12 | 2021 |
| Impedance-matching shunt: Current sensor with ultrahigh bandwidth and extremely low parasitics for wide-bandgap device Y Wang, Z Zeng, T Long, P Sun, L Wang, M Zou IEEE Transactions on Power Electronics 37 (10), 11528-11533, 2022 | 6 | 2022 |
| Online deformation characterization for electrothermal-mechanical effect of power module via confocal methodology P Sun, Z Zeng, L Wang, Y Wang, X Han IEEE Transactions on Power Electronics 37 (2), 1195-1200, 2021 | 6 | 2021 |
| A low-computation indirect model predictive control for modular multilevel converters W Ma, P Sun, G Zhou, G Sailijiang, Z Zhang, Y Liu Journal of Power Electronics 19 (2), 529-539, 2019 | 6 | 2019 |
| In situ full-field deformation characterization of power module and FEA model calibration based on stereo digital image methodology P Sun, Y Liang, L Wang, Y Wang, M Zou, Z Zeng IEEE Transactions on Power Electronics, 2023 | 2 | 2023 |
| PZT-based mitigation of voltage overshooting and switching oscillation for SiC MOSFET X Han, P Sun, M Zou, K Li, Y Liang, F Niu, Z Zeng 2022 IEEE International Power Electronics and Application Conference and …, 2022 | 2 | 2022 |
| 考虑直流断路器的 VSC-MTDC 系统鲁棒阻尼控制器设计 马文忠， 周冠宇， 孙鹏， 张子昂， 董磊 电力系统自动化 44 (6), 84-90, 2020 | 2 | 2020 |
| Focuses and Concerns of Dynamic Test for Wide Bandgap Device: A Questionnaire-Based Survey P Sun, M Zou, Y Wang, J Gong, Y Liang, F Niu, K Jiang, W Gao, Z Zeng IEEE Transactions on Power Electronics, 2023 | 1 | 2023 |
| Transmission Line Rogowski Coil: Isolated Current Sensor With Bandwidth Exceeding 3 GHz for Wide-Bandgap Device Y Wang, T Long, M Zou, P Sun, J Gong, L Wang, L Shillaber, F Blaabjerg, ... IEEE Transactions on Power Electronics, 2023 | 1 | 2023 |
| FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module P Sun, F Niu, Z Zeng, K Li, K Ou IEEE Transactions on Device and Materials Reliability, 2023 | 1 | 2023 |
| 基于响应面的车用功率模块 Pin-Fin 优化设计 张嘉伟， 曾正， 孙鹏， 王亮 电工技术学报 37 (22), 5836-5850, 2022 | 1 | 2022 |
| Dynamic Deformation Oriented Thermo-Mechanical Performance Assessment for Automotive Power Module With Various PWM Schemes P Sun, M Zou, F Niu, Y Liang, J Gong, Y Wang, M Luo, J Song, Z Zeng IEEE Transactions on Power Electronics, 2023 | | 2023 |
| Power Loss Assessment of Three-Level Neutral-Point-Clamped Inverter With DPWM Modulation M Luo, M Zou, F Niu, Y Liang, P Sun, Z Zeng 2023 IEEE 6th International Electrical and Energy Conference (CIEEC), 4246-4251, 2023 | | 2023 |
| Modeling and Assessment of Thermal Impedance Considering Layout and Parameter Dispersion for Multichip SiC Power Module Y Liang, P Sun, X Han, J Gong, F Niu, Z Zeng 2022 IEEE International Power Electronics and Application Conference and …, 2022 | | 2022 |
| Reshaped Switching Trajectory of SiC MOSFET via Co-Optimized Active Gate Driver M Zou, P Sun, Y Wang, Z Zeng, K Li, X Han 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-8, 2022 | | 2022 |
| Observation of PWM-Dependent Chip Deformation of Automotive Power Module P Sun, L Wang, Y Wang, Z Zeng, X Han, M Zou, K Li 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-6, 2022 | | 2022 |
| 模块化多电平变换器两段式模型预测控制 W MA, P SUN, G ZHOU, G SAILIJIANG, Z ZHANG, Y LIU, Y WANG 电网技术 44 (4), 2019 | | 2019 |
| 功率模块封装键合线的通流能力: 模型与实证 艾盛祥， 曾正， 王亮， 孙鹏， 张嘉伟 电工技术学报 37 (20), 5227-5240, 0 | | |
Zheng ZengSchool of Electrical Engineering, Chongqing University, ChinaVerified email at cqu.edu.cn
