Elliptocyte detection technology based on super-resolution algorithms for a lensless imaging system J Li, L Dai, N Yu, Z Li, S Li Measurement Science and Technology 32 (2), 025701, 2020 | 9 | 2020 |
Red blood cell recognition and posture estimation in microfluidic chip based on lensless imaging J Li, L Dai, N Yu, Y Wu Biomicrofluidics 15 (3), 034109, 2021 | 6 | 2021 |
Measurement of red blood cell size based on a lensless imaging system J Li, L Dai, N Yu, Z Li, S Li Biotechnology and Applied Biochemistry 68 (6), 1348-1356, 2020 | 5 | 2020 |
Statistical interconnect crosstalk noise model and analysis for process variations J Li, G Dong, Z Wang Chinese Journal of Electronics 24 (1), 83-87, 2015 | 3 | 2015 |
Fast statistical delay evaluation of RC interconnect in the presence of process variations L Jianwei, D Gang, Y Yintang, W Zeng Journal of Semiconductors 31 (4), 045010, 2010 | 3 | 2010 |
Lensless light intensity model for quasi-spherical cell size measurement J Li, L Dai, N Yu, Z Li, S Li Biomedical Microdevices 24 (2), 21, 2022 | 2 | 2022 |
Z-axis displacement measurement model of quasi-spherical cells based on microfluidics under lensless imaging J Li, L Dai, N Yu, Y Wu Measurement Science and Technology 32 (11), 115404, 2021 | 2 | 2021 |
Adaptive Parameter Model for Quasi-Spherical Cell Size Measurement Based on Lensless Imaging System J Li, L Dai, N Yu, Z Li, S Li IEEE Transactions on NanoBioscience 20 (4), 521 - 529, 2021 | 2 | 2021 |
A deep learning feature fusion algorithm based on Lensless cell detection system S Li, L Dai, J Li, C Wang, N Yu 2020 IEEE 15th International Conference on Solid-State & Integrated Circuit …, 2020 | 2 | 2020 |
考虑温度分布效应的非对称 RLC 树时钟偏差研究 王增, 董刚, 杨银堂, 李建伟 物理学报, 5646-5651, 2010 | 2 | 2010 |
Variation RLC model of interconnect based on weibull distribution L Jianwei, Y Yintang, D Gang, W Zeng 2009 IEEE 8th International Conference on ASIC, 1240-1243, 2009 | 2 | 2009 |
考虑工艺波动影响的 RLC 互连统计延时 李建伟, 董刚, 杨银堂, 王增 电子与信息学报 31 (11), 2767-2771, 2009 | 1 | 2009 |
工艺波动致 RLC 互连延时极值分析 李建伟, 董刚, 杨银堂, 王增 西安电子科技大学学报 36 (2), 301-307, 2009 | 1 | 2009 |
Electrical Resistivity Model for SSTA of Cu Nanowires J Li, L Dai, N Yu 2019 IEEE International Conference on Electron Devices and Solid-State …, 2019 | | 2019 |
考虑非均匀温度分布效应的缓冲器插入最优尺寸研究 王增, 董刚, 杨银堂, 李建伟 物理学报 61 (5), 126-132, 2012 | | 2012 |
虚拟通孔对互连温度变化的影响 王增, 董刚, 杨银堂, 李建伟 科学通报 56 (8), 617-622, 2011 | | 2011 |
考虑非均匀温度分布的 RLC 互连延时 王增, 杨银堂, 董刚, 李建伟 浙江大学学报 (工学版) 45 (5), 835-839, 2011 | | 2011 |
考虑工艺波动的 RC 互连树统计功耗 董刚, 薛萌, 李建伟, 杨银堂 物理学报 60 (3), 486-493, 2011 | | 2011 |
考虑工艺波动的快速 RC 互连延时统计计算 L Jianwei, D Gang, Y Yintang, W Zeng Journal of Semiconductors 31 (4), 045010-5, 2010 | | 2010 |
Fast statistical delay evaluation of RC interconnect in the presence of process variations 李建伟, 董刚, 杨银堂, 王增 半导体学报: 英文版, 104-108, 2010 | | 2010 |