| Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives EMD Pena, S Roy Surface and Coatings Technology 339, 101-110, 2018 | 58 | 2018 |
| Hygroscopicity of 1: 2 Choline chloride: Ethylene glycol deep eutectic solvent: A hindrance to its electroplating industry adoption JR Brusas, EMBD Pena Journal of Electrochemical Science and Technology 12 (4), 387-397, 2021 | 13 | 2021 |
| Nanoclay Supported Zero-Valent Iron as an Efficient Adsorbent Material for Arsenic LJLDPD Michael Leo Dela Cruz, Eden May Dela Pena, Khryslyn Arano Advance Materials Research 686, 296 – 304, 2013 | 12 | 2013 |
| Electrochemical effect of copper gleam additives during copper electrodeposition EM Dela Pena, S Roy Transactions of the IMF 95 (3), 158-164, 2017 | 6 | 2017 |
| Dynamic adsorption of aqueous arsenic on electrospun nanofibrous mat EMD Pena University of the Philippines-Diliman, Quezon City, 2011 | 6 | 2011 |
| Electrodeposition of copper using additive-containing low metal ion concentration electrolytes for Enface applications EMB Dela Pena | 5 | 2017 |
| Qualitative Analysis of the Effect of Polymer Solution and Suspension Properties on the Electrospinning of Nanocomposite Fibers MLDCLJLDPD Khryslyn Arano, Eden May Dela Pena Advance Materials Research 686, 65 -70, 2013 | 4 | 2013 |
| The design of a bench‐scale adsorbent column based on nanoclay‐loaded electrospun fiber membrane for the removal of arsenic in wastewater EMB Dela Peña, K Araño, ML Dela Cruz, PA de Yro, LJL Diaz Water and Environment Journal 35 (3), 937-942, 2021 | 3 | 2021 |
| A black chrome plating process using trivalent chromium and water-tolerant, ethaline-based ionic liquid baths GR Nablo, EM Dela Pena Chemical Papers 75 (9), 4887-4897, 2021 | 2 | 2021 |
| Effect of additive concentration during copper deposition using EnFACE electrolyte EM Dela Pena, N Bains, A Hussain, A Cobley, S Roy Transactions of the IMF 93 (6), 288-293, 2015 | 2 | 2015 |
| Nickel Electrodeposition Using Deep Eutectic Solvent-based Electrolyte EMB dela Peña Philippine Journal of Science 152 (2), 591-604, 2023 | 1 | 2023 |
| An environment-friendly chromium electrodeposition process using additive-laden deep eutectic solvent JRB Brusas, EMBD Pena Materials Today: Proceedings, 2023 | 1 | 2023 |
| Effect of Electrolyte Concentration and Voltage on the Morphology and Corrosion Resistance of PEO Coated AA6061 EMB Dela Pena, S Orgen Electrochemical Society Meeting Abstracts 244, 1125-1125, 2023 | | 2023 |
| Effect of Electrolyte Concentration and Voltage on the Morphology and Corrosion Resistance of PEO Coated AA6061 EMBD Pena, S Orgen 244th ECS Meeting (October 8-12, 2023), 2023 | | 2023 |
| Chromium Electrodeposition Using Choline Chloride Based Deep Eutectic Solvent EMB Dela Pena, M Itang Electrochemical Society Meeting Abstracts 240, 1812-1812, 2021 | | 2021 |
| Chromium Electrodeposition Using Choline Chloride Based Deep Eutectic Solvent EMBD Pena, M Itang 240th ECS Meeting (October 10-14, 2021), 2021 | | 2021 |
| Towards A Green and Sustainable Electropolishing Technology: Feasibility Studies on the Application of Choline Chloride-based Solvents for Electropolishing Aluminum EMD Peña, MP de Boda, FS Napiri Philippine Engineering Journal 41 (2), 2020 | | 2020 |
| Pulse Electrodeposited Copper from Lean Electrolytes Containing Additives S Roy, EM Dela Pena Electrochemical Society Meeting Abstracts 236, 1051-1051, 2019 | | 2019 |
| The Properties of Pulse-Plated Copper Derived from Additive-Bearing, Low-Metal Ion Concentration Electrolytes EMD Pena, S Roy Electrochemical Society Meeting Abstracts 236, 1050-1050, 2019 | | 2019 |
| Synthesis of Iron-Modified Montmorillonite as Filler for Electrospun Nanocomposite Fibers K Araño, D Cruz, M Leo, D Pena, E May, LJ Diaz International Journal of Materials and Metallurgical Engineering 8 (5), 408-410, 2014 | | 2014 |
