| IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique CE Ho, SP Yang, PT Lee, CY Lee, CC Chen, TT Kuo Journal of Materials Research and Technology 11, 1895-1910, 2021 | 31 | 2021 |
| High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF) PT Lee, CH Chang, CY Lee, YS Wu, CH Yang, CE Ho Materials & Design 206, 109830, 2021 | 28 | 2021 |
| Self-annealing behavior of electroplated Cu with different brightener concentrations CH Yang, YW Lee, CY Lee, PT Lee, CE Ho Journal of The Electrochemical Society 167 (8), 082514, 2020 | 23 | 2020 |
| Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship BC Huang, CH Yang, CY Lee, YL Hu, CC Hsu, CE Ho Microelectronics reliability 96, 71-77, 2019 | 23 | 2019 |
| Significantly improving the etching characteristics of electroplated Cu films through microstructure modification CY Lee, PC Lin, CH Yang, CE Ho Surface and Coatings Technology 386, 125471, 2020 | 21 | 2020 |
| Influence of Pd (P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd (P)/Ni (P)/Cu multilayer CY Lee, SP Yang, CH Yang, MK Lu, TT Kuo, CE Ho Surface and Coatings Technology 395, 125879, 2020 | 18 | 2020 |
| In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage CH Yang, SP Yang, BC Huang, CY Lee, HC Liu, CE Ho Surface and Coatings Technology 364, 383-391, 2019 | 14 | 2019 |
| High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage PT Lee, YS Wu, CY Lee, HC Liu, CE Ho Journal of The Electrochemical Society 165 (13), D647, 2018 | 14 | 2018 |
| Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure PT Lee, WZ Hsieh, CY Lee, SC Tseng, MT Tang, CY Chiang, CR Kao, ... Scripta Materialia 214, 114682, 2022 | 8 | 2022 |
| Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 PT Lee, WZ Hsieh, CY Lee, YH Huang, CY Chiang, CS Ku, CR Kao, ... Journal of Materials Research and Technology 13, 1316-1322, 2021 | 8 | 2021 |
| Self-annealing behavior of electroplated Cu in blind-hole structures CH Yang, YW Lee, CY Lee, CH Chang, CE Ho Journal of The Electrochemical Society 166 (13), D683, 2019 | 7 | 2019 |
| Significantly improving the mechanical/electrical characteristics of blind-hole Cu filling through crystal coherent modification YM Lin, CY Lee, YL Chen, CP Pan, CE Ho Surface and Coatings Technology 433, 128111, 2022 | 3 | 2022 |
| Nanoindentation study of single-crystalline and (101)-oriented nanotwinned Cu CH Yang, CY Lee, BC Huang, PC Lin, CE Ho ECS Journal of Solid State Science and Technology 8 (6), P363, 2019 | 3 | 2019 |
| White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal-into Monoclinic-Cu6Sn5 PT Lee, WZ Hsieh, CY Lee, CR Kao, CE Ho 2021 International Conference on Electronics Packaging (ICEP), 113-114, 2021 | 1 | 2021 |
| Nanotwinned structure CE Ho, BC Huang, CH Yang, CY Lee US Patent App. 16/705,138, 2020 | | 2020 |
| Effect of Brightener Concentration on Recrystallization Process of Electroplated Cu CH Yang, YW Lee, CY Lee, YH Huang, CE Ho ECS Meeting Abstracts, 2172, 2019 | | 2019 |
| Synchrotron X-Ray Characterization of Microstructure Transition and Stress Relaxation of Electroplated Cu upon Self-annealing YH Huang, WZ Hsieh, CY Lee, CH Yang, SJ Chiu, CS Ku, CE Ho | | |
