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Wing-Hung KiThe Hong Kong University of Science and TechnologyVerified email at ust.hk- Quan PanSouthern University of Science and TechnologyVerified email at sustech.edu.cn
- Salahuddin RajuScientist, Senior Member of IEEEVerified email at ieee.org
- Yan LuAssociate Professor, University of MacauVerified email at umac.mo
- Liang WuThe Chinese University of Hong Kong, ShenzhenVerified email at ieee.org
- Mansun ChanChair Professor, HKUSTVerified email at ust.hk
- Frank O'MahonyIntelVerified email at intel.com
- Kei May LauHong Kong University of Science & TechnologyVerified email at ust.hk
- Rongxiang WUAssociate Professor of Microelectronics and Solid-State Electronics, UESTCVerified email at uestc.edu.cn
- Mark HorowitzProfessor of Electrical Engineering and Computer ScienceVerified email at ee.stanford.edu
- H. Tom SohProfessor of Electrical Engineering and Radiology, Stanford UniversityVerified email at stanford.edu
- Piljae ParkETRIVerified email at etri.re.kr
- Mark J.W. RodwellProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraVerified email at ece.ucsb.edu
- Li SunPrincipal Engineer at MarvellVerified email at marvell.com
- patrick yin chiangAssociate Professor of Electrical and Computer Engineering, Oregon State UniversityVerified email at eecs.oregonstate.edu
- Zongyu DongQualcomm Technology IncVerified email at ucr.edu
- Philip K.T. Mok, IEEE FellowProfessor of Dept of ECE, Hong Kong University of ScienceVerified email at ust.hk
- Upamanyu MadhowProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraVerified email at ece.ucsb.edu
- James A. BainProfessor of ECE, Carnegie Mellon UniversityVerified email at ece.cmu.edu
- Chi Ying TsuiHong Kong University of Science and TechnologyVerified email at ece.ust.hk
