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Weisheng DongSchool of Electronic Engineering, Xidian University, ChinaVerified email at mail.xidian.edu.cn
Guangming ShiSchool of Electronic Engineering, Xidian University, China; Peng Cheng LaboratoryVerified email at xidian.edu.cn
Lei ZhangChair Professor, Dept. of Computing, The Hong Kong Polytechnic UniversityVerified email at comp.polyu.edu.hk
Jinjian Wuxidian universityVerified email at mail.xidian.edu.cn
Yanfang (Fanny) YeCollegiate Associate Professor of of Computer Science and Engineering, University of Notre DameVerified email at nd.edu
Yi Ma (马毅)Professor of EECS, University of California, BerkeleyVerified email at eecs.berkeley.edu
Chuanbo HuWest Virginia UniversityVerified email at mail.wvu.edu
Shuo WangWashington University in St. LouisVerified email at wustl.edu
shifu houCase Western Reserve UniversityVerified email at case.edu
Zhiguo CaoHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Wei HuPeking UniversityVerified email at pku.edu.cn
Chen ZhaoÉcole polytechnique fédérale de LausanneVerified email at epfl.ch
Leida LiSchool of Artificial Intelligence, Xidian University, ChinaVerified email at xidian.edu.cn
Bahadir GunturkIstanbul Medipol University, School of Engineering and Natural SciencesVerified email at medipol.edu.tr
Jiaqi YangNorthwestern Polytechnical UniversityVerified email at nwpu.edu.cn
Lingwei ChenWright State UniversityVerified email at wright.edu
Gene CheungProfessor, Department of EECS, York UniversityVerified email at yorku.ca
Xiaolin WuProfessor of Electrical and Computer Engineering, McMaster UniversityVerified email at ece.mcmaster.ca
Yiming ZhangWest Virginia University; Case Western Reserve UniversityVerified email at mix.wvu.edu
Yujie FanVisa ResearchVerified email at visa.com