Get my own profile
Public access
View all6 articles
43 articles
available
not available
Based on funding mandates
Co-authors
Huazhong YangProfessor of Electronics Engineering, Tsinghua UniversityVerified email at tsinghua.edu.cn
Ali M NIKNEJADUC BerkeleyVerified email at berkeley.edu
Nai-Chung KuoUniversity of California, BerkeleyVerified email at berkeley.edu
Jingna MaoChinese Academy of ScienceVerified email at ia.ac.cn
Yong LianNational University of SingaporeVerified email at nus.edu.sg
Yong CHEN (Nick)Tsinghua UniversityVerified email at tsinghua.edu.cn
Mohamad SawanPolytechnique Montréal, Canada; Westlake University, China.Verified email at westlake.edu.cn
Gang Pan (潘纲)Professor of Computer Science, Zhejiang UniversityVerified email at zju.edu.cn
Shuangchen LiResearch Scientist, DAMO Academy, Alibaba GroupVerified email at alibaba-inc.com
Sijun DuAssistant Professor, Delft University of TechnologyVerified email at tudelft.nl
Lorenzo IottiIC Designer, NokiaVerified email at nokia.com
YI-AN LIUC BerkeleyVerified email at berkeley.edu
Rui MartinsLife Fellow IEEE, Chair Professor (ECE), Director of IME, University of MacauVerified email at um.edu.mo
Pui-In Mak (Elvis)Professor at University of Macau | IEEE Fellow | IET Fellow | RSC Fellow | CAS Overseas ExpertVerified email at umac.mo
"Chun-Huat Heng"National University of SingaporeVerified email at nus.edu.sg
Yinan SunTsinghua Univ.Verified email at tsinghua.edu.cn
Yu Wang (汪玉)Department of Electronic Engineering, Tsinghua University, ChinaVerified email at mail.tsinghua.edu.cn
Liwei LinProfessor of Mechanical Engineering, University of California at BerkeleyVerified email at me.berkeley.edu
Huiliang LiuUniversity of California, Berkeley; Tsinghua University; China Academy of Space TechnologyVerified email at berkeley.edu
Kong-pang PunThe Chinese University of Hong KongVerified email at ee.cuhk.edu.hk