| Material characterization and warpage modeling for power devices active metal brazed substrates G Mirone, A Sitta, G D’Arrigo, M Calabretta IEEE Transactions on Device and Materials Reliability 19 (3), 537-542, 2019 | 28 | 2019 |
| The" first and euRopEAn siC eighT Inches pilOt liNe": a project, called REACTION, that will boost key SiC Technologies upgrading (developments) in Europe, unleashing … AA Messina, A Imbruglia, M Calabretta, V Vinciguerra, CC Moise, A Sitta, ... 2020 AEIT International Conference of Electrical and Electronic Technologies …, 2020 | 26 | 2020 |
| Thermal analysis approach for predicting power device lifetime S Russo, G Bazzano, D Cavallaro, A Sitta, M Calabretta IEEE Transactions on Device and Materials Reliability 19 (1), 159-163, 2019 | 26 | 2019 |
| Thermal measurement and numerical analysis for automotive power modules A Sitta, M Renna, AA Messina, G Sequenzia, G D’Arrigo, M Calabretta 2020 21st International Conference on Thermal, Mechanical and Multi-Physics …, 2020 | 21 | 2020 |
| Silver sintering for silicon carbide die attach: process optimization and structural modeling M Calabretta, A Sitta, SM Oliveri, G Sequenzia Applied Sciences 11 (15), 7012, 2021 | 19 | 2021 |
| Design and process optimization of a sintered joint for power electronics automotive applications M Calabretta, A Sitta, SM Oliveri, G Sequenzia Design Tools and Methods in Industrial Engineering: Proceedings of the …, 2020 | 19 | 2020 |
| Numerical approach to predict power device reliability A Sitta, S Russo, G Bazzano, D Cavallaro, G Greco, M Calabretta 2018 13th International Conference on Design & Technology of Integrated …, 2018 | 17 | 2018 |
| Silicon carbide multi-chip power module for traction inverter applications: thermal characterization and modeling M Calabretta, A Sitta, SM Oliveri, G Sequenzia IEEE Access 9, 76307-76314, 2021 | 16 | 2021 |
| Mechanical properties of amorphous Ge2Sb2Te5 thin layers G D'Arrigo, A Mio, G Favaro, M Calabretta, A Sitta, A Sciuto, M Russo, ... Surface and Coatings Technology 355, 227-233, 2018 | 16 | 2018 |
| Solder joint reliability: Thermo-mechanical analysis on power flat packages A Sitta, M Calabretta, M Renna, D Cavallaro Advances on Mechanics, Design Engineering and Manufacturing: Proceedings of …, 2017 | 16 | 2017 |
| Fast transient thermomechanical stress to set a pressure-assisted sintering process M Santopá, S Russo, M Torrisi, M Renna, A Sitta, M Calabretta 2019 15th Conference on Ph. D Research in Microelectronics and Electronics …, 2019 | 15 | 2019 |
| Power semiconductor devices and packages: Solder mechanical characterization and lifetime prediction M Calabretta, A Sitta, SM Oliveri, G Sequenzia IEEE Access 9, 22859-22867, 2021 | 14 | 2021 |
| An integrated approach to optimize power device performances by means of stress engineering M Calabretta, A Sitta, SM Oliveri, G Sequenzia Design Tools and Methods in Industrial Engineering: Proceedings of the …, 2020 | 14 | 2020 |
| An integrated approach to optimize solder joint reliability A Sitta, S Russo, M Torrisi, AA Messina, G D’Arrigo, G Sequenzia, ... 2020 21st International Conference on Thermal, Mechanical and Multi-Physics …, 2020 | 12 | 2020 |
| Copper wire bonding process characterization and simulation A Mancaleoni, A Sitta, A Colombo, R Villa, G Mirone, M Renna, ... CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020 | 11 | 2020 |
| Power Module Ceramic Substrates: mechanical characterization and modeling A Sitta, M Renna, AA Messina, G Mirone, G D’Arrigo, M Calabretta 2020 21st International Conference on Thermal, Mechanical and Multi-Physics …, 2020 | 10 | 2020 |
| Directly cooled silicon carbide power modules: thermal model and experimental characterization G Mauromicale, A Cascio, M Papaserio, DG Cavallaro, G Bazzano, ... PCIM Europe digital days 2021; International Exhibition and Conference for …, 2021 | 9 | 2021 |
| Mechanical and electrical characterization of CVD-grown graphene transferred on chalcogenide Ge2Sb2Te5 layers G D'Arrigo, M Christian, V Morandi, G Favaro, C Bongiorno, AM Mio, ... Carbon 132, 141-151, 2018 | 9 | 2018 |
| Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis M Calabretta, A Sitta, SM Oliveri, G Sequenzia Engineering Fracture Mechanics 266, 108339, 2022 | 8 | 2022 |
| Lifetime modeling for silicon carbide based power module M Calabretta, A Messina, A Sitta SAE Technical Papers, 2021 | 6 | 2021 |
