| Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane MPC Watts, L Hendler US Patent 5,656,942, 1997 | 101 | 1997 |
| Defect detection using fourier optics and a spatial separator for simultaneous optical computing of separated fourier transform components L Hendler, MPC Watts US Patent 5,506,676, 1996 | 68 | 1996 |
| Automated model building and model updating L Hendler, SD Lazarovich, R Hadar, N Kettaneh, U Levami, D Perlroizen US Patent 8,271,103, 2012 | 47 | 2012 |
| High-speed, high-resolution, large area inspection using multiple optical fourier transform cells L Hendler, MPC Watts, RA Portune US Patent 5,966,212, 1999 | 34 | 1999 |
| Self-correcting multivariate analysis for use in monitoring dynamic parameters in process environments UJ Lev-Ami, L Hendler US Patent 7,809,450, 2010 | 23 | 2010 |
| Process control using process data and yield data L Hendler, KC Lin, SB Wold US Patent 7,622,308, 2009 | 20 | 2009 |
| Classifying faults associated with a manufacturing process L Hendler, UJ Lev-Ami US Patent App. 11/451,223, 2008 | 16 | 2008 |
| Method and apparatus for classifying manufacturing outputs L Hendler, M Richter US Patent 7,313,454, 2007 | 11 | 2007 |
| Plasma Spraying and Recrystallization of Thick Film Layer R Zehavi, S Zehavi, L Hendler, T Dulkin US Patent App. 12/789,357, 2010 | 10 | 2010 |
| Process control using process data and yield data L Hendler, KC Lin, SB Wold US Patent 7,996,102, 2011 | 7 | 2011 |
| Automated model building and model updating L Hendler, SD Lazarovich, R Hadar, N Kettaneh, U Levami, D Perlroizen US Patent App. 13/568,881, 2012 | 4 | 2012 |
| Image plane holography for holographic presentation of a three-dimensional data base L Hendler, SS Friedland Computers & Mathematics with Applications 12 (6), 777-784, 1986 | 1 | 1986 |
| Manufacturing process end point detection L Hendler, M Richter US Patent 7,630,786, 2009 | | 2009 |
| Wafer probing in a micro-environment L Hendler, M Peddy, R Portune TEST-BUCKINGHAM THEN LONDON-ANGEL PUBLISHING THEN INSIDE COMMUNICATIONS- 17, S-6, 1995 | | 1995 |
| c-SI Wafer Development: A New Approach to Reduce Costs and Drive Efficiency S Zehavi, N Reef, A Blosse, D Weiss, L Hendler | | |
