| Thermal management of 3D IC integration with TSV (through silicon via) JH Lau, TG Yue 2009 59th Electronic Components and Technology Conference, 635-640, 2009 | 226 | 2009 |
| Joule heating effect on electroosmotic flow and mass species transport in a microcapillary GY Tang, C Yang, JC Chai, HQ Gong International Journal of Heat and Mass Transfer 47 (2), 215-227, 2004 | 226 | 2004 |
| Development of through silicon via (TSV) interposer technology for large die (21× 21mm) fine-pitch Cu/low-k FCBGA package X Zhang, TC Chai, JH Lau, CS Selvanayagam, K Biswas, S Liu, D Pinjala, ... 2009 59th Electronic components and technology conference, 305-312, 2009 | 135 | 2009 |
| Assessment of Joule heating and its effects on electroosmotic flow and electrophoretic transport of solutes in microfluidic channels G Tang, D Yan, C Yang, H Gong, JC Chai, YC Lam Electrophoresis 27 (3), 628-639, 2006 | 135 | 2006 |
| Numerical analysis of the thermal effect on electroosmotic flow and electrokinetic mass transport in microchannels GY Tang, C Yang, CK Chai, HQ Gong Analytica Chimica Acta 507 (1), 27-37, 2004 | 110 | 2004 |
| Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP) JH Lau, TG Yue Microelectronics Reliability 52 (11), 2660-2669, 2012 | 104 | 2012 |
| Modeling of electroosmotic flow and capillary electrophoresis with the joule heating effect: The Nernst− Planck equation versus the Boltzmann distribution GY Tang, C Yang, CJ Chai, HQ Gong Langmuir 19 (26), 10975-10984, 2003 | 80 | 2003 |
| Integrated liquid cooling systems for 3-D stacked TSV modules GY Tang, SP Tan, N Khan, D Pinjala, JH Lau, AB Yu, K Vaidyanathan, ... IEEE Transactions on Components and Packaging Technologies 33 (1), 184-195, 2010 | 76 | 2010 |
| Joule heating and its effects on electrokinetic transport of solutes in rectangular microchannels G Tang, D Yan, C Yang, H Gong, C Chai, Y Lam Sensors and Actuators A: Physical 139 (1-2), 221-232, 2007 | 62 | 2007 |
| Effect of TSV interposer on the thermal performance of FCBGA package YYG Hoe, TG Yue, P Damaruganath, CT Chong, JH Lau, Z Xiaowu, ... 2009 11th Electronics Packaging Technology Conference, 778-786, 2009 | 58 | 2009 |
| Thermal optimization and characterization of SiC-based high power electronics packages with advanced thermal design G Tang, T chong Chai, X Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (5 …, 2018 | 36 | 2018 |
| Thermal management of hotspots using diamond heat spreader on Si microcooler for GaN devices Y Han, BL Lau, G Tang, X Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 36 | 2015 |
| Concentration enhancement of sample solutes in a sudden expansion microchannel with Joule heating Z Ge, C Yang, G Tang International journal of heat and mass transfer 53 (13-14), 2722-2731, 2010 | 36 | 2010 |
| Si-based hybrid microcooler with multiple drainage microtrenches for high heat flux cooling Y Han, BL Lau, G Tang, X Zhang, DMW Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (1 …, 2016 | 35 | 2016 |
| Numerical modeling of Joule heating‐induced temperature gradient focusing in microfluidic channels G Tang, C Yang Electrophoresis 29 (5), 1006-1012, 2008 | 34 | 2008 |
| Joule heating and its effects on electroosmotic flow in microfluidic channels GY Tang, DG Yan, C Yang, HQ Gong, CJ Chai, YC Lam Journal of Physics: Conference Series 34 (1), 925, 2006 | 30 | 2006 |
| Numerical simulation of Joule heating effect on sample band transport in capillary electrophoresis GY Tang, C Yang, HQ Gong, JC Chai, YC Lam Analytica chimica acta 561 (1-2), 138-149, 2006 | 29 | 2006 |
| Development of a compact and efficient liquid cooling system with silicon microcooler for high-power microelectronic devices G Tang, Y Han, BL Lau, X Zhang, DMW Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (5 …, 2016 | 17 | 2016 |
| Hybrid micro-fluid heat sink for high power dissipation of liquid-cooled data centre Y Han, G Tang, BL Lau, X Zhang 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-4, 2017 | 16 | 2017 |
| Design and analysis of 3D stacked optoelectronics on optical printed circuit boards JH Lau, YY Lim, TG Lim, GY Tang, CH Khong, X Zhang, PV Ramana, ... Photonics Packaging, Integration, and Interconnects VIII 6899, 72-91, 2008 | 16 | 2008 |
