| Second nearest-neighbor modified embedded-atom method interatomic potentials for the Co-M (M= Ti, V) binary systems SH Oh, D Seol, BJ Lee Calphad 70, 101791, 2020 | 17 | 2020 |
| Second-nearest-neighbor modified embedded-atom method interatomic potential for Cu-M (M= Co, Mo) binary systems J Wang, SH Oh, BJ Lee Computational Materials Science 178, 109627, 2020 | 10 | 2020 |
| Diffusion in A15 Nb3Sn: An atomistic study SH Oh, D Seol, YJ Jeong, SH Na, J Kim, WS Ko, JB Jeon, BJ Lee Acta Materialia 234, 118050, 2022 | 7 | 2022 |
| Second nearest-neighbor modified embedded-atom method interatomic potentials for the Mo-M (M= Al, Co, Cr, Fe, Ni, Ti) binary alloy systems SH Oh, JS Kim, CS Park, BJ Lee Computational Materials Science 194, 110473, 2021 | 7 | 2021 |
| A full-scale Monte Carlo Potts model and real time conversion under non-uniform temperature distribution SH Oh, M Lee, BJ Lee Materials & Design 225, 111439, 2023 | 4 | 2023 |
| Pressure dependence of thermodynamic interaction parameters for binary solid solution phases: An atomistic simulation study SH Oh, XG Lu, Q Chen, BJ Lee Calphad 75, 102342, 2021 | 3 | 2021 |
| A second nearest-neighbor modified embedded-atom method combined with a charge equilibration interatomic potential for the Al-O binary system JS Lee, J Ji, SH Oh, BJ Lee Computational Materials Science 230, 112505, 2023 | 2 | 2023 |
| Atomic behavior of Ti in A15 Nb3Sn and its effects on diffusional growth of Nb3Sn layer SH Oh, YJ Jeong, SH Na, J Kim, A Zargaran, BJ Lee Journal of Alloys and Compounds 957, 170438, 2023 | 2 | 2023 |
| Formation of columnar grains during diffusional growth of Nb3Sn layer and its suppression SH Oh, YJ Jeong, SH Na, J Kim, BJ Lee Acta Materialia 263, 119542, 2024 | 1 | 2024 |
| Si-enabled self-lubrication and wear resistance of CrCoNiSi medium-entropy alloy films YM Kim, TJ Jang, W Song, HS Do, SH Oh, G Lee, J Kim, E Yang, BJ Lee, ... Journal of Materials Research and Technology 30, 5429-5443, 2024 | | 2024 |
| Prediction of Interfacial Reaction Between Cu and In During Low-Temperature Soldering SH Oh, K Chu, BJ Lee Journal of Phase Equilibria and Diffusion 43 (6), 876-882, 2022 | | 2022 |
Byeong-Joo LeePOSTECHVerified email at postech.ac.kr
Byeong-Joo LeePOSTECHVerified email at postech.ac.kr